TT Electronics/IRC

GS7B0256R2FDT

GS7B0256R2FDT Description

The GS7B0256R2FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 14-pin narrow SOIC package, it features 13 bussed resistors with a 56.2Ω resistance value and a tight ±1% absolute tolerance (±0.5% ratio tolerance). Built using thin-film technology, it delivers excellent stability with a ±50ppm/°C temperature coefficient, ensuring reliable performance across a -70°C to +125°C operating range. The SOIC-C series construction offers robust ceramic case durability, ideal for harsh environments. With a 0.7W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances power handling and compactness (8.66mm × 5.99mm × 1.45mm).

GS7B0256R2FDT Features

• Bussed Network: 13 resistors share a common node, simplifying circuit design for bus applications.
• Precision Thin Film: Low TCR (±50ppm/°C) and 1% tolerance ensure accuracy in signal conditioning.
• Robust Packaging: Ceramic SOIC case resists thermal stress, with gull-wing leads for reliable SMT assembly.
• Wide Temperature Range: Operates from -70°C to +125°C (derated power up to 125°C).
• High Voltage Handling: Supports up to 100V, suitable for industrial and automotive subsystems (non-automotive PPAP).
• Compact Footprint: Space-saving SOIC-14 package with ±0.1mm length/height tolerances for precise PCB integration.

GS7B0256R2FDT Applications

• Signal Termination: Ideal for CAN bus, SPI, or I²C line termination due to low tolerance and bussed design.
• Voltage Division: Precision ratio tolerance (±0.5%) suits ADC reference networks and sensor interfaces.
• Industrial Controls: Ceramic construction withstands high temps in motor drives or power supplies.
• Test Equipment: Stable thin-film resistors ensure repeatability in measurement circuits.
• Aerospace/Defense: Non-RoHS version may be used in legacy systems requiring high reliability.

Conclusion of GS7B0256R2FDT

The GS7B0256R2FDT excels in precision networks where thermal stability, compactness, and high voltage tolerance are critical. Its ceramic SOIC package and bussed architecture reduce component count in bus-oriented designs, while thin-film technology guarantees long-term accuracy. Though not automotive-grade, it’s a robust choice for industrial, telecom, and instrumentation applications demanding tight tolerances and durability. Engineers will value its balance of performance and integration ease in space-constrained, high-reliability systems.