TT Electronics/IRC

GS7B025902JFT

GS7B025902JFT Description

The GS7B025902JFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 14-pin narrow SOIC package features 13 bussed resistors, each with a 59 kΩ resistance value and a ±5% absolute tolerance. Built using thin-film technology, it offers excellent stability with a low temperature coefficient of ±50 ppm/°C, ensuring reliable performance across a wide temperature range of -70°C to +125°C. The device is rated for 100V maximum voltage and delivers a total power rating of 0.7W (0.05W per resistor), making it suitable for compact, high-density PCB designs. Its gull-wing termination and surface-mount compatibility facilitate easy assembly in automated processes.

GS7B025902JFT Features

• Ceramic substrate for enhanced thermal and mechanical stability.
• Bussed network topology simplifies circuit design by interconnecting resistors.
• Low TCR (±50 ppm/°C) ensures minimal resistance drift under temperature fluctuations.
• High power density (0.7W total) in a compact SOIC package (8.66 x 5.99 x 1.45 mm).
• Precision tolerance (±5% absolute, ±1% ratio) for consistent performance.
• Wide operating range (-70°C to +125°C), ideal for industrial and automotive environments (though not PPAP/automotive-qualified).
• RoHS non-compliant (contains lead), suitable for legacy or specialized applications.

GS7B025902JFT Applications

This resistor network excels in:

• Voltage division and pull-up/down circuits in microcontrollers and FPGAs.
• Signal conditioning for sensors and analog front-ends.
• Power supply feedback networks requiring stable, matched resistances.
• Industrial control systems where temperature resilience and compactness are critical.
• Legacy electronics repair due to its non-RoHS compliance.

Conclusion of GS7B025902JFT

The GS7B025902JFT combines precision, durability, and space efficiency, making it a robust choice for engineers prioritizing reliability in harsh environments. Its thin-film construction and bussed design reduce board complexity, while the wide temperature range ensures versatility across industrial and consumer applications. Though not automotive-grade, its performance metrics align with demanding use cases where stability and miniaturization are paramount.