TT Electronics/IRC

GS7B026800CCT

GS7B026800CCT Description

The GS7B026800CCT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 14-pin narrow SOIC package, it features 13 bussed (BUS) thin-film resistors, each with a 680Ω resistance and an exceptional ±0.25% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a ±50ppm/°C temperature coefficient, ensuring stability in harsh environments. Its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for precision analog and digital circuits. The SOIC-C series construction offers robust ceramic substrate reliability, while the gull-wing termination ensures secure surface mounting.

GS7B026800CCT Features

• High Precision: ±0.25% tolerance and ±50ppm/°C TCR for stable performance.
• Robust Construction: Ceramic case and thin-film technology enhance durability and thermal management.
• Space-Efficient: Compact 8.66mm × 5.99mm × 1.45mm footprint with 1.27mm terminal pitch for high-density PCB layouts.
• Wide Operating Range: Derated power up to 125°C, ideal for automotive-industrial hybrids (though not PPAP/Automotive certified).
• Bussed Design: Simplified circuit routing with 13 resistors sharing a common node, reducing component count.
• Non-RoHS: Suitable for legacy or specialized applications where RoHS compliance is not required.

GS7B026800CCT Applications

• Precision Voltage Dividers: Critical in ADC/DAC reference circuits due to low tolerance and TCR.
• Signal Conditioning: Ideal for sensor interfaces and instrumentation amplifiers requiring matched resistors.
• Industrial Controls: Reliable performance in PLCs, motor drives, and power management systems.
• Telecom Infrastructure: Stable operation in baseband processing and RF filtering networks.
• Legacy Systems: Non-RoHS compliance suits military/aerospace refurbishments or niche industrial equipment.

Conclusion of GS7B026800CCT

The GS7B026800CCT excels in precision and reliability, leveraging ceramic thin-film technology for applications demanding tight tolerances and thermal stability. Its bussed architecture reduces design complexity, while the SOIC package ensures compatibility with automated assembly. Though not automotive-grade, it is a cost-effective solution for industrial, telecom, and legacy systems where accuracy and durability are paramount. Engineers will appreciate its balance of performance, size, and ruggedness in critical circuits.