TT Electronics/IRC

GS7B026800JCT

GS7B026800JCT Description

The GS7B026800JCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 14-pin Narrow SOIC device features 13 bussed resistors with a 680Ω resistance value and a ±5% absolute tolerance, ensuring reliable signal integrity. Built with thin-film technology, it offers a low ±50ppm/°C temperature coefficient, making it stable across a wide operating temperature range of -70°C to +125°C. The SOIC package (8.66mm x 5.99mm x 1.45mm) provides a compact footprint, ideal for space-constrained designs. With a 0.7W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances power handling with precision.

GS7B026800JCT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Bussed network topology simplifies circuit design by connecting multiple resistors to a common node.
• Thin-film technology ensures low noise and high accuracy (±5% tolerance, ±0.25% ratio tolerance).
• Gull-wing termination enables reliable surface-mount (SMD) assembly with a 1.27mm terminal pitch.
• Wide temperature range (-70°C to +125°C) with derated power up to 125°C.
• Non-automotive, non-PPAP compliant, suited for industrial and commercial applications.
• Non-RoHS (contains lead), which may be preferred for certain high-reliability environments.

GS7B026800JCT Applications

This resistor network excels in:

• Analog signal conditioning (e.g., voltage dividers, pull-up/pull-down networks).
• Bus termination in digital systems to reduce signal reflections.
• Precision instrumentation where stable resistance values are critical.
• Embedded systems requiring compact, multi-resistor solutions.
• Industrial control boards due to its rugged ceramic construction and thermal resilience.

Conclusion of GS7B026800JCT

The GS7B026800JCT stands out for its ceramic-based reliability, thin-film precision, and bussed architecture, making it a robust choice for engineers prioritizing stability and space efficiency. While not suited for automotive or RoHS-restricted designs, its wide temperature range and low TCR make it ideal for industrial, telecom, and high-performance computing applications. Its SOIC package ensures compatibility with standard PCB assembly processes, offering a balance of performance and manufacturability.