TT Electronics/IRC

GS7B026982FFT

GS7B026982FFT Description

The GS7B026982FFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 14-pin Narrow SOIC package features 13 bussed resistors with a 69.8 kΩ resistance value, offering an absolute tolerance of ±1% and a ratio tolerance of ±1%. Built with thin-film technology, it ensures excellent stability and low noise, making it ideal for signal conditioning and voltage division tasks. The device operates within a wide temperature range of -55°C to +125°C, with a derated power range of 70°C to 125°C, and delivers a total power rating of 0.7W (0.05W per resistor). Its ±50 ppm/°C temperature coefficient guarantees minimal resistance drift under thermal stress.

GS7B026982FFT Features

• Ceramic substrate for enhanced thermal and mechanical reliability.
• Gull-wing termination for secure surface-mount (SMD) assembly.
• SOIC package (8.66 x 5.99 x 1.45 mm) with tight tolerances (±0.1 mm height/length, ±0.2 mm depth).
• 100V maximum voltage rating, suitable for industrial and telecom applications.
• Non-automotive (PPAP: No) and EU RoHS non-compliant, tailored for specialized use cases.
• Bussed network topology simplifies PCB layout in multi-resistor designs.
• Superior thin-film construction ensures long-term stability and precision.

GS7B026982FFT Applications

This resistor network excels in:

• Precision analog circuits (e.g., sensor interfaces, ADC/DAC networks).
• Voltage dividers and bus termination in communication hardware.
• Industrial control systems requiring stable, high-density resistance arrays.
• Test and measurement equipment where low drift and tight tolerances are critical.
• Power management modules in non-automotive environments.

Conclusion of GS7B026982FFT

The GS7B026982FFT stands out for its robust ceramic construction, high accuracy (±1%), and thermal stability (±50 ppm/°C), making it a reliable choice for engineers prioritizing precision in compact designs. While not suited for automotive use, its SOIC package and bussed architecture streamline integration in industrial, telecom, and instrumentation applications. For projects demanding low-noise, high-voltage thin-film networks, this model delivers exceptional performance.