


TT Electronics/IRC
GS7B028871FBT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS7B028871FBT Description
GS7B028871FBT Description
The GS7B028871FBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 thin-film resistors with a 1% absolute tolerance and an exceptional ±0.1% ratio tolerance, ensuring consistent performance in precision circuits. With a resistance value of 8.87KΩ and a ±50ppm/°C temperature coefficient, it delivers stable operation across a wide temperature range (70°C to 125°C). The SOIC-C series construction features a rectangular ceramic case, gull-wing termination, and surface-mount compatibility, making it ideal for space-constrained designs.
GS7B028871FBT Features
- High Precision: ±1% absolute tolerance and ±0.1% ratio tolerance for critical analog/digital applications.
- Robust Construction: Ceramic substrate ensures durability and thermal stability.
- Wide Operating Range: Rated for 125°C maximum temperature and 100V maximum voltage.
- Thin-Film Technology: Delivers low noise and high reliability.
- Compact Design: 8.66mm × 5.99mm × 1.45mm dimensions with tight tolerances (±0.1mm height, ±0.2mm depth).
- Bussed Configuration: Simplifies PCB layout for bus line applications.
- Low TCR: ±50ppm/°C ensures minimal resistance drift.
GS7B028871FBT Applications
This resistor network excels in:
- Precision voltage dividers and reference circuits in test/measurement equipment.
- Signal conditioning for ADCs/DACs in industrial automation.
- Bus termination for high-speed digital interfaces (e.g., CAN, I2C).
- Medical devices requiring stable, low-drift resistance networks.
- Aerospace/defense systems where ceramic reliability is critical.
Conclusion of GS7B028871FBT
The GS7B028871FBT stands out for its precision, compactness, and ceramic-based ruggedness, making it a superior choice over plastic-encapsulated networks in harsh environments. Its bussed architecture reduces component count, while thin-film technology ensures long-term stability. Ideal for high-reliability industrial, medical, and automotive (non-PPAP) applications, this network balances performance with space efficiency. Engineers seeking a high-tolerance, thermally stable solution will find it indispensable in precision circuitry.



.png)














.png?x-oss-process=image/format,webp/resize,h_32)










