TT Electronics/IRC

GS7B029310GDT

GS7B029310GDT Description

The GS7B029310GDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. This 14-pin narrow SOIC (SOIC-C Series) device integrates 13 bussed resistors with a 931Ω resistance value, offering an absolute tolerance of ±2% and a ratio tolerance of ±0.5%. Built with thin-film technology, it ensures stable performance across a wide temperature range (70°C to 125°C) and features a low temperature coefficient of ±50ppm/°C. The 0.7W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for compact, high-density circuits. Its ceramic case and gull-wing termination provide robust mechanical and thermal stability, ideal for surface-mount applications.

GS7B029310GDT Features

• Precision Network: 13 bussed resistors with ±2% absolute tolerance and ±0.5% ratio tolerance.
• Stable Performance: ±50ppm/°C temperature coefficient ensures reliability across -55°C to +125°C.
• Robust Construction: Ceramic SOIC package (8.66mm x 5.99mm x 1.45mm) with ±0.1mm height/length tolerances.
• High Power Handling: 0.7W total power (0.05W per resistor) and 100V max voltage rating.
• Surface-Mount Ready: Gull-wing terminals with 1.27mm pitch for easy PCB integration.
• Non-Automotive: Not PPAP-capable, but suitable for industrial and telecom applications.

GS7B029310GDT Applications

• Voltage Divider Networks: Precision ratio tolerance (±0.5%) ideal for analog signal conditioning.
• Industrial Controls: Stable performance in harsh environments (e.g., PLCs, motor drives).
• Telecom Equipment: Compact SOIC footprint suits high-density RF and baseband circuits.
• Test & Measurement: Low TCR (±50ppm/°C) ensures accuracy in calibrated instruments.
• Power Management: Bussed design simplifies bus termination and pull-up/down networks.

Conclusion of GS7B029310GDT

The GS7B029310GDT excels in precision and durability, combining thin-film accuracy, ceramic robustness, and SOIC compactness. Its bussed architecture and tight tolerances make it a standout choice for industrial, telecom, and instrumentation designs where space and stability are critical. While not automotive-grade, its wide temperature range and low TCR ensure reliable operation in demanding electronic systems.