TT Electronics/IRC

GS7B0297R6JDT

GS7B0297R6JDT Description

The GS7B0297R6JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 14-pin Narrow SOIC package features 13 bussed resistors with a 97.6Ω resistance value, offering a ±5% absolute tolerance and ±0.5% ratio tolerance for consistent performance. Built with thin-film technology, it ensures excellent stability and low noise, making it ideal for signal conditioning and voltage division tasks. The device operates within a wide temperature range of -55°C to +125°C, with a derated power range of 70°C to 125°C, and supports a maximum voltage rating of 100V. Its SOIC package (8.66mm x 5.99mm x 1.45mm) provides a compact footprint for space-constrained designs.

GS7B0297R6JDT Features

• Bussed Network Design: Simplifies circuit layout with 13 interconnected resistors.
• High Precision: ±50ppm/°C temperature coefficient ensures minimal drift.
• Robust Construction: Ceramic substrate enhances thermal and mechanical durability.
• Surface-Mount Gull Wing Terminals: Facilitates automated PCB assembly.
• Power Handling: 0.05W per resistor (0.7W total) supports moderate power applications.
• Wide Operating Range: Suitable for industrial and automotive environments (non-AEC-Q qualified).
• Non-RoHS Compliant: Ideal for legacy or specialized systems requiring leaded components.

GS7B0297R6JDT Applications

This resistor network excels in:

• Analog Signal Processing: Voltage dividers, DAC/ADC interfaces.
• Industrial Control Systems: PLCs, sensor conditioning circuits.
• Telecommunications: Impedance matching in RF modules.
• Test & Measurement Equipment: Precision calibration networks.
• Power Management: Current sensing and feedback loops.

Conclusion of GS7B0297R6JDT

The GS7B0297R6JDT combines high reliability, compact design, and excellent electrical performance, making it a preferred choice for engineers seeking stable resistor networks in harsh environments. Its bussed architecture reduces component count, while the ceramic substrate ensures longevity. Though not PPAP or automotive-grade, it remains a cost-effective solution for industrial and telecom applications requiring tight tolerance and low thermal drift.