TT Electronics/IRC

GS7B031002FFT

GS7B031002FFT Description

The GS7B031002FFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 14-pin narrow SOIC (SOIC-C series), it features 13 bussed (BUS) thin-film resistors, each with a 10KΩ resistance and a tight ±1% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a derated power range of 70°C to 125°C, ensuring reliability in demanding environments. Its ±25ppm/°C temperature coefficient minimizes resistance drift, while the 0.05W (1/20W) power rating per resistor and 0.7W total power rating provide robust performance in compact designs. The 100V maximum voltage rating and 1.27mm terminal pitch make it suitable for high-density PCB layouts.

GS7B031002FFT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Thin-film technology ensures precision and low noise.
• 14-pin SOIC package with gull-wing termination for easy surface mounting.
• Bussed (BUS) configuration simplifies circuit design for common-node applications.
• Tight tolerances: ±1% absolute and ±1% ratio tolerance for matched performance.
• Low TCR (±25ppm/°C) for minimal resistance variation across temperatures.
• Compact dimensions: 8.66mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D).
• Non-automotive, non-PPAP compliant, ideal for industrial and commercial use.

GS7B031002FFT Applications

This resistor network excels in:

• Precision voltage dividers and signal conditioning circuits.
• Analog and mixed-signal systems requiring stable resistance matching.
• Medical instrumentation and test/measurement equipment where low drift is critical.
• Industrial control systems operating in wide temperature ranges.
• Communication infrastructure (e.g., RF modules, filters) demanding high accuracy.

Conclusion of GS7B031002FFT

The GS7B031002FFT stands out for its ceramic construction, thin-film precision, and bussed topology, offering superior stability and ease of integration. While not RoHS-compliant, its high-temperature resilience, low TCR, and tight tolerances make it a preferred choice for engineers designing high-reliability, space-constrained applications. Its SOIC package ensures compatibility with automated assembly processes, reducing manufacturing complexity. For projects requiring matched resistors with minimal drift, this network delivers exceptional performance.