TT Electronics/IRC

GS7B031071JGT

GS7B031071JGT Description

The GS7B031071JGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 14-pin narrow SOIC package features 13 bussed resistors with a 1.07KΩ resistance value and a ±5% absolute tolerance, ensuring reliable performance in demanding circuits. Built with thin-film technology, it offers a low temperature coefficient of ±25ppm/°C, making it stable across a wide operating temperature range of -70°C to +125°C. The SOIC-C series construction provides excellent thermal and mechanical stability, while the gull-wing termination ensures secure surface mounting. With a power rating of 0.7W (0.05W per resistor) and a maximum voltage rating of 100V, this network is ideal for high-density PCB designs requiring consistent resistance values.

GS7B031071JGT Features

• Ceramic substrate for enhanced durability and thermal performance.
• Bussed circuit design simplifies routing in bus-oriented applications.
• Low TCR (±25ppm/°C) ensures minimal resistance drift under temperature variations.
• Narrow SOIC package (8.66mm x 5.99mm x 1.45mm) saves board space.
• Precision tolerance (±5% absolute, ±2% ratio) for accurate signal conditioning.
• Thin-film technology delivers superior stability and low noise.
• Wide operating temperature range (-70°C to +125°C) suits harsh environments.
• Gull-wing leads for reliable surface-mount assembly.

GS7B031071JGT Applications

This resistor network excels in:

• Voltage divider circuits requiring tight tolerance ratios.
• Bus termination in digital communication systems (e.g., CAN, I2C).
• Sensor signal conditioning where stability is critical.
• Industrial control systems exposed to wide temperature swings.
• Medical electronics demanding high reliability and precision.
• Automotive subsystems (non-AECQ qualified, suitable for non-safety-critical uses).

Conclusion of GS7B031071JGT

The GS7B031071JGT stands out for its ceramic construction, precision tolerances, and robust thermal performance, making it a superior choice for engineers designing high-reliability analog and digital circuits. While not PPAP or automotive-qualified, its thin-film technology and bussed architecture provide exceptional value in industrial, medical, and communication applications where space efficiency and stability are paramount. Its SOIC package and gull-wing termination further ensure compatibility with automated assembly processes, reducing manufacturing costs.