TT Electronics/IRC

GS7B031181JFT

GS7B031181JFT Description

The GS7B031181JFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 14-pin narrow SOIC package, it features 13 bussed resistors with a 1.18KΩ resistance and ±5% absolute tolerance. Built with thin-film technology, it offers excellent stability with a ±25ppm/°C temperature coefficient and operates within a wide temperature range of 70°C to 125°C. The SOIC-C series construction ensures robust performance in demanding environments, with a maximum voltage rating of 100V and a power rating of 0.7W (0.05W per resistor). Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GS7B031181JFT Features

• Ceramic case for enhanced thermal and mechanical durability.
• Bussed network topology simplifies circuit design by interconnecting resistors.
• Thin-film technology ensures low noise and high precision (±1% ratio tolerance).
• Wide operating range (-55°C to +125°C derated) for industrial and automotive-grade reliability.
• Compact dimensions: 8.66mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).
• RoHS non-compliant, suitable for legacy systems requiring leaded components.

GS7B031181JFT Applications

Ideal for analog signal conditioning, voltage dividers, and impedance matching in:

• Industrial control systems requiring stable resistance under thermal stress.
• Medical devices where precision and longevity are critical.
• Telecommunications equipment leveraging its low TCR for signal integrity.
• Legacy electronics needing non-RoHS compliant, high-reliability networks.

Conclusion of GS7B031181JFT

The GS7B031181JFT stands out for its ceramic-based robustness, thin-film accuracy, and bussed design efficiency. While not PPAP or automotive-qualified, its wide temperature range and tight tolerances make it a superior choice for precision electronics in harsh environments. Engineers will value its balance of performance, durability, and ease of integration in space-constrained designs.