TT Electronics/IRC

GS7B031302JT

GS7B031302JT Description

The GS7B031302JT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 14-pin narrow SOIC device features 13 bussed resistors, each with a 13KΩ resistance and a ±5% tolerance. Built with thin-film technology, it delivers excellent stability with a low temperature coefficient of ±25ppm/°C, ensuring reliable performance across a wide operating range of -70°C to +125°C. The SOIC package offers a compact footprint (8.66mm x 5.99mm x 1.45mm) with gull-wing terminations for easy surface-mount assembly. Rated for 100V maximum voltage and 0.7W total power dissipation, it is ideal for space-constrained designs requiring consistent resistance matching.

GS7B031302JT Features

• 13 bussed resistors in a 14-pin SOIC package for simplified circuit design.
• Thin-film technology ensures high precision (±5%) and low TCR (±25ppm/°C).
• Wide temperature range (-70°C to +125°C) with derated power handling.
• Compact & robust ceramic case (SOIC-C series) for durability in harsh environments.
• Gull-wing termination (1.27mm pitch) for reliable SMT soldering.
• Non-automotive grade (PPAP: No) but suitable for industrial and telecom applications.
• 100V maximum voltage rating and 0.05W per resistor power handling.

GS7B031302JT Applications

This resistor network excels in:

• Voltage division and pull-up/pull-down networks in digital circuits.
• Signal conditioning for sensors and analog front-end systems.
• Industrial control systems requiring stable resistance under thermal stress.
• Telecommunications equipment where space efficiency and reliability are critical.
• Test & measurement devices demanding tight tolerance and low drift.

Conclusion of GS7B031302JT

The GS7B031302JT stands out for its ceramic construction, thin-film precision, and bussed architecture, making it a superior choice for applications needing matched resistors in a compact form factor. While not RoHS-compliant, its wide temperature range and robust performance make it ideal for industrial, telecom, and instrumentation designs. Engineers will appreciate its balance of density, reliability, and ease of integration in surface-mount assemblies.