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GS7B031602FCT
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GS7B031602FCT Description
GS7B031602FCT Description
The GS7B031602FCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 14-pin narrow SOIC package, it features 13 bussed resistors with a 16 kΩ resistance value and a tight ±1% absolute tolerance (±0.25% ratio tolerance). Built using thin-film technology, it delivers excellent stability with a low ±25 ppm/°C temperature coefficient. The device operates over a wide temperature range of -55°C to +125°C (derated power up to 125°C) and supports a maximum voltage rating of 100V. With a 0.7W total power rating (0.05W per resistor), it is ideal for space-constrained, high-reliability designs.
GS7B031602FCT Features
- Ceramic SOIC package ensures durability and thermal performance.
- Bussed network topology simplifies circuit design for bus termination and pull-up/down applications.
- Low TCR (±25 ppm/°C) minimizes resistance drift in varying temperatures.
- 1% tolerance and ±0.25% ratio tolerance for precision signal conditioning.
- Gull-wing termination enables reliable surface-mount assembly.
- Non-automotive, non-PPAP compliant, suited for industrial and telecom applications.
- Compact dimensions (8.66 x 5.99 x 1.45 mm) with tight tolerances (±0.1 mm height/length).
GS7B031602FCT Applications
This resistor network excels in:
- Voltage divider circuits requiring matched resistance ratios.
- Bus termination in high-speed digital systems (e.g., memory interfaces).
- Sensor signal conditioning where stability and precision are critical.
- Industrial control systems demanding robust, temperature-resistant components.
- Telecom infrastructure for impedance matching and filtering.
Conclusion of GS7B031602FCT
The GS7B031602FCT stands out for its ceramic construction, precision tolerances, and bussed architecture, making it a superior choice for high-reliability, space-constrained designs. While not RoHS-compliant, its thermal stability and thin-film accuracy cater to demanding industrial and communication applications. Engineers will benefit from its ease of integration and consistent performance across temperature extremes.



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