TT Electronics/IRC

GS7B031621FBT

GS7B031621FBT Description

The GS7B031621FBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding applications requiring stable performance under varying conditions. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 thin-film resistors, each with a resistance value of 1.62KΩ and an absolute tolerance of ±1%. The device operates over a wide temperature range (70°C to 125°C) with a low temperature coefficient of ±25ppm/°C, ensuring minimal resistance drift. Its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for precision analog and digital circuits. The SOIC-C series construction offers robust ceramic substrate reliability, while the gull-wing termination facilitates easy surface mounting.

GS7B031621FBT Features

• High Precision: ±1% absolute tolerance and ±0.1% ratio tolerance for matched resistance values.
• Stable Performance: Low TCR (±25ppm/°C) ensures reliability across temperature fluctuations.
• Robust Construction: Ceramic case style enhances thermal and mechanical durability.
• Space-Efficient: Compact 8.66mm × 5.99mm × 1.45mm footprint with 1.27mm terminal pitch.
• Surface-Mount Ready: Gull-wing terminals simplify PCB assembly.
• Wide Voltage Range: Supports up to 100V, ideal for industrial and automotive (non-PPAP) applications.
• Non-Automotive Grade: Suitable for general-purpose electronics where PPAP compliance is not required.

GS7B031621FBT Applications

This resistor network excels in:

• Voltage Divider Networks: Precision dividers in sensor interfaces or ADC circuits.
• Signal Conditioning: Stable biasing and termination in communication systems.
• Industrial Control Systems: High-reliability feedback networks in PLCs and motor drives.
• Test & Measurement Equipment: Low-drift reference circuits for accurate instrumentation.
• Consumer Electronics: Compact analog signal processing in audio/video devices.

Conclusion of GS7B031621FBT

The GS7B031621FBT combines precision, stability, and compactness, making it a versatile choice for engineers prioritizing tight tolerance and thermal performance. While not PPAP-compliant, its ceramic thin-film technology and bussed architecture offer superior reliability for industrial, telecom, and consumer applications. Its SOIC package ensures compatibility with automated assembly processes, reducing manufacturing costs. For designs requiring low TCR and high voltage handling, this network stands out among similar models.