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GS7B031652JBT
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GS7B031652JBT Description
GS7B031652JBT Description
The GS7B031652JBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 14-pin narrow SOIC device features 13 bussed resistors with a 16.5KΩ resistance value and a ±5% absolute tolerance, ensuring reliable performance in tightly controlled environments. Built with thin-film technology, it offers a low temperature coefficient of ±25ppm/°C, making it ideal for stable operation across a wide temperature range of 70°C to 125°C. The SOIC package (8.66mm x 5.99mm x 1.45mm) with gull-wing terminations ensures easy surface-mount integration, while its 0.7W total power rating (0.05W per resistor) provides robust power handling.
GS7B031652JBT Features
- Ceramic Construction: Ensures durability and thermal stability in harsh conditions.
- Bussed Network Design: Simplifies circuit layout with shared connections for streamlined designs.
- Precision Tolerance: ±5% absolute and ±0.1% ratio tolerance for high-accuracy applications.
- Low TCR (±25ppm/°C): Minimizes resistance drift under temperature fluctuations.
- Surface-Mount SOIC Package: Compact footprint (8.66mm x 5.99mm) with 1.27mm pitch for high-density PCBs.
- Wide Voltage Rating: Supports up to 100V, suitable for industrial and automotive systems (non-automotive PPAP).
GS7B031652JBT Applications
This resistor network excels in:
- Analog Signal Conditioning: Precision voltage dividers and sensor interfaces.
- Industrial Control Systems: Stable performance in PLCs and motor drives.
- Test & Measurement Equipment: Low-drift resistance for calibration circuits.
- Power Management: Current-limiting and feedback networks in DC/DC converters.
- Medical Electronics: Reliable operation in diagnostic devices where consistency is critical.
Conclusion of GS7B031652JBT
The GS7B031652JBT stands out for its ceramic thin-film construction, tight tolerances, and thermal stability, making it a superior choice for precision electronics. Its bussed architecture reduces component count, while the SOIC package ensures compatibility with automated assembly. Though not RoHS-compliant, its robust performance in industrial, medical, and instrumentation applications justifies its use in specialized designs requiring long-term reliability.



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