TT Electronics/IRC

GS7B031821FDT

GS7B031821FDT Description

The GS7B031821FDT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding surface-mount applications. This 14-pin narrow SOIC package features 13 bussed resistors with a 1.82KΩ resistance value, offering an absolute tolerance of ±1% and a ratio tolerance of ±0.5%. Built with thin-film technology, it ensures excellent stability with a low temperature coefficient of ±25ppm/°C. The device operates within a wide temperature range of -70°C to +125°C, making it suitable for harsh environments. With a power rating of 0.7W (0.05W per resistor) and a maximum voltage rating of 100V, it balances performance and reliability in compact designs.

GS7B031821FDT Features

• Ceramic SOIC-C Series: Robust construction for thermal and mechanical stability.
• Bussed Network: Simplified circuit design with shared connections.
• High Precision: ±1% absolute tolerance and ±0.5% ratio tolerance.
• Low TCR: ±25ppm/°C ensures minimal resistance drift.
• Wide Operating Range: -70°C to +125°C with derated power up to 125°C.
• Surface-Mount Gull Wing Terminals: Facilitates automated PCB assembly.
• Compact Dimensions: 8.66mm (L) x 5.99mm (D) x 1.45mm (H) with tight tolerances.

GS7B031821FDT Applications

This resistor network is ideal for:

• Precision analog circuits requiring stable resistance ratios.
• Industrial control systems where temperature fluctuations are common.
• Medical instrumentation demanding high accuracy and reliability.
• Automotive electronics (non-automotive qualified, but suitable for prototyping).
• Power management modules needing compact, high-density resistor arrays.

Conclusion of GS7B031821FDT

The GS7B031821FDT stands out for its ceramic thin-film construction, exceptional tolerance, and thermal stability, making it a superior choice for precision applications. While not PPAP or automotive-qualified, its performance in industrial, medical, and high-reliability systems justifies its use where accuracy and durability are critical. Its SOIC package ensures compatibility with standard PCB processes, offering a balance of space efficiency and performance.