TT Electronics/IRC

GS7B031911GAT

GS7B031911GAT Description

The GS7B031911GAT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 thin-film resistors, each with a 1.91KΩ resistance and a tight ±2% absolute tolerance. Its ±25ppm/°C temperature coefficient ensures stable performance across a wide operating range of -70°C to +125°C, making it suitable for environments with thermal fluctuations. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount (SMD) assembly. With a 0.7W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances compactness with robustness.

GS7B031911GAT Features

• Precision Thin-Film Technology: Delivers low noise and high stability, critical for analog signal conditioning.
• Bussed Network Design: Simplifies PCB layout by interconnecting resistors, reducing component count.
• Enhanced Thermal Performance: Ceramic substrate and ±25ppm/°C TCR minimize resistance drift under thermal stress.
• Compact & Reliable: 8.66mm × 5.99mm footprint with 1.45mm profile, ideal for space-constrained designs.
• Automation-Friendly: Gull-wing leads and 1.27mm pitch ensure compatibility with pick-and-place systems.
• Non-Automotive (PPAP No): Tailored for industrial/commercial use, though not PPAP-certified.

GS7B031911GAT Applications

• Signal Conditioning: Precision voltage dividers in sensor interfaces or ADC/DAC circuits.
• Medical Electronics: Stable resistor networks for patient monitoring equipment requiring low drift.
• Test & Measurement: Calibration circuits in multimeters or oscilloscope probes.
• Industrial Controls: PLC modules or process instrumentation where temperature resilience is critical.
• Telecom Infrastructure: Line termination or impedance matching in high-frequency PCBs.

Conclusion of GS7B031911GAT

The GS7B031911GAT excels in applications demanding precision, thermal stability, and space efficiency. Its ceramic thin-film construction and bussed architecture offer superior performance over generic thick-film networks, particularly in high-reliability industrial systems. While not suited for automotive use, its 2% tolerance and low TCR make it a standout choice for medical, telecom, and test equipment. Engineers will appreciate its balance of compactness, power handling, and repeatability in critical circuit designs.