TT Electronics/IRC

GS7B032202CT

GS7B032202CT Description

The GS7B032202CT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 14-pin narrow SOIC package features 13 bussed resistors, each with a 22KΩ resistance and an ultra-tight ±0.25% tolerance, ensuring exceptional accuracy. Built with thin-film technology, it delivers a low ±25ppm/°C temperature coefficient, making it ideal for stable performance across a 70°C to 125°C operating range. The SOIC-C series construction offers robust ceramic case durability, with a 0.7W total power rating (0.05W per resistor) and a 100V maximum voltage rating. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GS7B032202CT Features

• Precision Network: 13 bussed resistors, 22KΩ ±0.25%, ensuring minimal deviation.
• Stable Performance: ±25ppm/°C TCR for reliable operation in thermal variations.
• Robust Construction: Ceramic SOIC package with 1.45mm height, resistant to mechanical stress.
• High Power Handling: 0.7W total (0.05W per resistor) at 125°C max operating temperature.
• Automation-Friendly: Gull-wing leads and 1.27mm pitch for seamless SMT assembly.
• Non-Automotive: Suitable for industrial/commercial use (PPAP: No, EU RoHS: Not Compliant).

GS7B032202CT Applications

This resistor network excels in precision analog and digital circuits, including:

• Voltage dividers and signal conditioning in test/measurement equipment.
• Feedback networks for op-amps and ADCs requiring low drift.
• Industrial control systems where stable resistance under thermal stress is critical.
• Medical devices demanding high accuracy (though RoHS non-compliance may limit use in some regions).
• Telecom infrastructure for impedance matching and termination.

Conclusion of GS7B032202CT

The GS7B032202CT stands out for its ceramic-based reliability, tight tolerance, and low TCR, making it a superior choice for precision applications. While not suited for automotive or RoHS-restricted designs, its thin-film technology and SOIC packaging offer a balance of performance and durability for industrial, medical, and telecom uses. Engineers will appreciate its ease of integration and consistent performance in thermally challenging environments.