TT Electronics/IRC

GS7B032321DT

GS7B032321DT Description

The GS7B032321DT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 14-pin narrow SOIC package, this bussed (BUS) configuration integrates 13 thin-film resistors, each with a 2.32KΩ resistance and an ultra-tight ±0.5% tolerance. The device operates over a wide temperature range of 70°C to 125°C with a low ±25ppm/°C temperature coefficient, ensuring stability in fluctuating environments. Its SOIC-C series construction offers 0.05W (1/20) power rating per resistor and a total power rating of 0.7W, making it suitable for compact, high-density PCB designs. With a 100V maximum voltage rating and gull-wing termination, it excels in surface-mount applications requiring reliability and precision.

GS7B032321DT Features

• 13-resistor bussed network in a 14-pin SOIC package for space-efficient designs.
• Ceramic substrate with thin-film technology for enhanced thermal and electrical performance.
• ±0.5% absolute tolerance and ±25ppm/°C TCR for precision-critical circuits.
• 0.7W total power dissipation (0.05W per resistor) with 125°C maximum operating temperature.
• Gull-wing termination and 1.27mm terminal pitch for easy surface-mount assembly.
• Compact dimensions: 8.66mm (L) × 5.99mm (D) × 1.45mm (H), with tight tolerances (±0.1mm L/H, ±0.2mm D).
• Non-automotive (PPAP No) and EU RoHS non-compliant, suited for industrial/commercial use.

GS7B032321DT Applications

• Voltage division and current limiting in precision analog circuits.
• Signal conditioning for sensors, ADCs, and DACs in test/measurement equipment.
• Bus termination and pull-up/pull-down networks in communication systems.
• Industrial control systems requiring stable resistance under thermal stress.
• Medical devices where tight tolerance and low TCR are critical.

Conclusion of GS7B032321DT

The GS7B032321DT stands out for its ceramic-based thin-film construction, exceptional tolerance, and thermal stability, making it ideal for precision electronics. Its SOIC package balances performance with space savings, while the bussed design simplifies circuit layout. While not suited for automotive use, it excels in industrial, medical, and communication applications where reliability and accuracy are paramount. Engineers will appreciate its low TCR, high power density, and ease of integration into surface-mount assemblies.