TT Electronics/IRC

GS7B032670JGT

GS7B032670JGT Description

The GS7B032670JGT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding surface-mount applications. This 14-pin narrow SOIC device integrates 13 bussed resistors with a 267Ω resistance value and ±5% absolute tolerance, ensuring consistent performance in compact designs. Built with thin-film technology, it delivers a low ±25ppm/°C temperature coefficient, making it ideal for stable operation across a -70°C to +125°C range. The SOIC package (8.66mm x 5.99mm x 1.45mm) features gull-wing terminations with a 1.27mm pitch, optimized for automated assembly. With a 0.7W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances power handling and space efficiency.

GS7B032670JGT Features

• Bussed Network: 13 resistors share a common node, simplifying circuit routing.
• High Stability: ±25ppm/°C TCR and ceramic substrate ensure minimal drift under thermal stress.
• Precision Tolerance: ±5% absolute and ±2% ratio tolerance for matched performance.
• Robust Construction: Thin-film technology and rectangular SOIC package enhance reliability in harsh environments.
• Automation-Friendly: Gull-wing leads and tight dimensional tolerances (±0.1mm height/length) suit pick-and-place processes.
• Wide Operating Range: Derated power up to 125°C, suitable for industrial and telecom applications.

GS7B032670JGT Applications

• Voltage Division: Precision dividers in ADC/DAC reference circuits.
• Bus Termination: Signal integrity in high-speed digital systems (e.g., DDR memory).
• Industrial Controls: Stable biasing in PLCs and sensor interfaces.
• Automotive Electronics: Non-automotive grade but usable in benign environments (e.g., infotainment).
• Power Management: Current limiting in low-power DC/DC converters.

Conclusion of GS7B032670JGT

The GS7B032670JGT excels in space-constrained designs requiring stable, matched resistances with minimal thermal drift. Its ceramic construction and thin-film technology offer superior performance over thick-film alternatives, while the bussed topology reduces PCB complexity. Though non-compliant with EU RoHS, it remains a cost-effective choice for industrial, telecom, and instrumentation applications where precision and durability are critical. Engineers will appreciate its balance of power handling, tolerance accuracy, and compact form factor.