TT Electronics/IRC

GS7B032672JT

GS7B032672JT Description

The GS7B032672JT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 thin-film resistors with a 26.7KΩ resistance value and a tight ±5% tolerance. Its ±25ppm/°C temperature coefficient ensures stability across a wide operating temperature range of 70°C to 125°C, making it suitable for thermally sensitive circuits. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount assembly. With a 0.7W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances power handling and compactness. Non-compliant with EU RoHS, it targets industrial and legacy systems.

GS7B032672JT Features

• Precision Thin Film Technology: Delivers low TCR (±25ppm/°C) and stable performance under thermal stress.
• Robust Ceramic Package: Enhances durability and heat dissipation in high-density PCB layouts.
• Bussed Network Design: Simplifies circuit routing with shared connections (BUS configuration).
• Narrow SOIC Footprint: 8.66mm × 5.99mm × 1.45mm dimensions with tight tolerances (±0.1mm height/length) for space-constrained designs.
• High Voltage Handling: Supports up to 100V, ideal for analog signal conditioning and power distribution.
• Industrial-Grade Reliability: Operates up to 125°C with derated power at elevated temperatures.

GS7B032672JT Applications

• Analog Signal Processing: Voltage dividers, DAC/ADC interfaces in test equipment.
• Power Management: Current sensing, load balancing in industrial controls.
• Legacy Systems: Replacement for obsolete networks in military/aerospace electronics.
• Automotive (Non-Automotive Rated): Secondary circuits where RoHS compliance is not critical.
• High-Density PCBs: Compact layouts in telecom infrastructure and medical devices.

Conclusion of GS7B032672JT

The GS7B032672JT excels in precision and reliability for industrial and high-temperature applications. Its ceramic thin-film construction, bussed architecture, and narrow SOIC form factor offer a competitive edge over polymer-based networks. While not RoHS-compliant, it fills a niche in harsh environments and legacy upgrades. Engineers will value its thermal stability, tight tolerances, and ease of integration in complex analog systems.