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GS7B033602JBT
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GS7B033602JBT Description
GS7B033602JBT Description
The GS7B033602JBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 14-pin Narrow SOIC device features 13 bussed resistors with a 36KΩ resistance value and a ±5% absolute tolerance, ensuring reliable performance in demanding circuits. Built with thin-film technology, it offers a low temperature coefficient of ±25ppm/°C, maintaining stability across a wide operating range of -70°C to +125°C. The SOIC package (8.66mm x 5.99mm x 1.45mm) with gull-wing terminations enables easy surface-mount assembly, while its 0.05W power rating per resistor (0.7W total) suits low-power designs.
GS7B033602JBT Features
- Bussed Network Configuration: Simplifies circuit design by connecting multiple resistors to a common node.
- High Precision: ±5% tolerance and ±0.1% ratio tolerance ensure consistent performance in matched circuits.
- Robust Construction: Ceramic substrate enhances thermal stability and durability.
- Wide Voltage Range: Supports up to 100V, ideal for industrial and automotive systems (though not PPAP/automotive-qualified).
- Low TCR: ±25ppm/°C minimizes resistance drift under temperature fluctuations.
- Compact Footprint: SOIC package saves board space while offering 1.27mm terminal pitch for easy soldering.
GS7B033602JBT Applications
This resistor network excels in:
- Signal Conditioning: Precision voltage dividers and feedback networks in analog circuits.
- Industrial Controls: Stable performance in PLCs, sensors, and power management systems.
- Test & Measurement Equipment: Low-drift resistance for calibration and instrumentation.
- Consumer Electronics: Space-constrained designs requiring reliable passive components.
- Telecommunications: Filtering and impedance matching in RF modules.
Conclusion of GS7B033602JBT
The GS7B033602JBT combines high precision, thermal resilience, and compact packaging, making it a versatile choice for engineers prioritizing stability and space efficiency. Its bussed architecture reduces component count, while thin-film technology ensures long-term reliability. Though not RoHS-compliant or automotive-grade, it remains a cost-effective solution for industrial, telecom, and precision electronics where tight tolerances and low TCR are critical.



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