TT Electronics/IRC

GS7B034872FBT

GS7B034872FBT Description

The GS7B034872FBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 14-pin narrow SOIC package, this bussed (BUS) configuration integrates 13 thin-film resistors, each with a 48.7KΩ resistance and a tight ±1% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a ±25ppm/°C temperature coefficient, ensuring stability in fluctuating environments. Its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for low-power, high-reliability circuits. The SOIC-C series construction features gull-wing terminations for robust surface-mount (SMD) assembly, with precise dimensional tolerances (±0.1mm height, ±0.2mm depth).

GS7B034872FBT Features

• High Precision: ±1% absolute tolerance and ±0.1% ratio tolerance for critical signal conditioning.
• Robust Construction: Ceramic substrate with thin-film technology for enhanced thermal and electrical performance.
• Wide Operating Range: Derated power up to 125°C, ideal for industrial and automotive-adjacent applications (non-Automotive PPAP).
• Compact Design: 8.66mm × 5.99mm footprint and 1.45mm profile saves PCB space.
• Low TCR: ±25ppm/°C minimizes resistance drift under thermal stress.
• Bussed Topology: Simplifies circuit design by interconnecting resistors via a common node.

GS7B034872FBT Applications

• Voltage Dividers: Precision attenuation in sensor interfaces or ADC front-ends.
• Signal Conditioning: Stable biasing and filtering in instrumentation amplifiers.
• Industrial Controls: Reliable performance in PLCs, motor drives, and power supplies.
• Medical Electronics: Low-noise, high-stability requirements in diagnostic equipment.
• Communications: Impedance matching and termination in RF modules.

Conclusion of GS7B034872FBT

The GS7B034872FBT excels in precision, thermal stability, and space efficiency, distinguishing it from generic resistor arrays. While non-compliant with EU RoHS, its ceramic SOIC package and thin-film technology cater to specialized industrial and telecom applications where accuracy and durability are paramount. Engineers will value its bussed architecture for simplifying designs without compromising performance. For OEMs requiring high-density, low-TCR networks, this model offers a compelling balance of specifications and reliability.