TT Electronics/IRC

GS7B035101JFT

GS7B035101JFT Description

The GS7B035101JFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications requiring stable resistance values and compact packaging. This 14-pin narrow SOIC device features 13 bussed resistors with a 5.1KΩ resistance value, offering a ±5% absolute tolerance and ±1% ratio tolerance. Built with thin-film technology, it ensures low noise and high reliability, with a ±25ppm/°C temperature coefficient for minimal drift across operating conditions. The SOIC-C series package provides robust mechanical stability, with a 0.7W total power rating (0.05W per resistor) and a 100V maximum voltage rating. Its surface-mount gull-wing termination facilitates easy PCB integration, while the ceramic case enhances thermal performance.

GS7B035101JFT Features

• 13 bussed resistors in a 14-pin SOIC package, ideal for space-constrained designs.
• Thin-film technology for superior stability, low noise, and ±25ppm/°C TCR.
• 5.1KΩ resistance with ±5% tolerance and ±1% ratio tolerance for precision matching.
• Ceramic case ensures high thermal conductivity and durability.
• 0.7W total power dissipation (0.05W per resistor) with derating up to 125°C.
• Gull-wing termination for reliable surface-mount assembly.
• Compact dimensions: 8.66mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances.
• Non-automotive and non-PPAP compliant, suitable for industrial and commercial use.

GS7B035101JFT Applications

This resistor network excels in:

• Voltage division and current limiting in precision analog circuits.
• Signal conditioning for sensors, ADCs, and DACs.
• Industrial control systems requiring stable resistance networks.
• Medical electronics where low drift and reliability are critical.
• Test and measurement equipment demanding tight tolerance matching.
• Embedded systems with space and performance constraints.

Conclusion of GS7B035101JFT

The GS7B035101JFT stands out for its ceramic construction, thin-film precision, and compact SOIC packaging, making it a top choice for applications requiring high stability and density. Its bussed design simplifies circuit layout, while the low TCR ensures consistent performance across temperature ranges. While not suited for automotive use, it is ideal for industrial, medical, and instrumentation applications where reliability and precision are paramount.