TT Electronics/IRC

GS7B035360BBT

GS7B035360BBT Description

The GS7B035360BBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Packaged in a 14-pin narrow SOIC (SOIC-C series), this bussed network integrates 13 thin-film resistors with a 536Ω resistance value and an exceptional ±0.1% absolute tolerance. Its ±25ppm/°C temperature coefficient ensures stability across a wide operating range of 70°C to 125°C, making it suitable for precision circuits. The 0.05W (1/20) power rating per resistor and 0.7W total power rating provide reliable performance in compact designs. With a 100V maximum voltage rating and gull-wing termination, it is optimized for surface-mount assembly.

GS7B035360BBT Features

• High Precision: ±0.1% tolerance and ±0.1% ratio tolerance for critical analog/digital applications.
• Stable Performance: Thin-film technology with ±25ppm/°C thermal drift.
• Robust Construction: Ceramic case ensures durability and thermal resistance.
• Space-Efficient: Compact 8.66mm × 5.99mm × 1.45mm SOIC package with 1.27mm terminal pitch.
• Bussed Design: Simplified PCB layout for shared-node circuits (e.g., pull-up/down networks).
• Wide Temperature Range: Operates reliably from 70°C to 125°C with derated power.

GS7B035360BBT Applications

Ideal for:

• Precision voltage dividers in instrumentation and sensor interfaces.
• Signal conditioning in industrial control systems.
• Pull-up/down resistor arrays for microcontrollers and FPGAs.
• Medical electronics requiring tight tolerance and thermal stability.
• Automotive test systems (though not PPAP/AEC-Q200 qualified).

Conclusion of GS7B035360BBT

The GS7B035360BBT excels in high-accuracy, space-constrained designs where thermal stability and tight tolerances are critical. Its ceramic construction, bussed architecture, and thin-film technology offer superior reliability over comparable thick-film networks. While not automotive-grade, it is a cost-effective solution for industrial, medical, and test equipment requiring consistent performance under thermal stress. Engineers will appreciate its balance of precision, power handling, and compact form factor.