TT Electronics/IRC

GS7B035492JDT

GS7B035492JDT Description

The GS7B035492JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 thin-film resistors, each with a 54.9KΩ resistance and a ±5% absolute tolerance. The device operates over a wide temperature range of 70°C to 125°C with a low temperature coefficient of ±25ppm/°C, ensuring stability in demanding environments. With a power rating of 0.7W (0.05W per resistor) and a maximum voltage rating of 100V, it is engineered for reliability in surface-mount applications. The SOIC-C series construction features gull-wing terminations and a compact footprint (8.66mm x 5.99mm x 1.45mm), making it suitable for space-constrained designs.

GS7B035492JDT Features

• High Precision: ±25ppm/°C TCR and ±5% tolerance ensure consistent performance.
• Robust Construction: Ceramic substrate and thin-film technology enhance durability and thermal stability.
• Space-Efficient: 14-pin SOIC package with a 1.27mm terminal pitch optimizes PCB layout.
• Bussed Design: Simplifies circuit routing with shared connections for streamlined designs.
• Wide Operating Range: Rated for 125°C maximum temperature and derated power up to 70°C.
• Surface-Mount Ready: Gull-wing terminations facilitate automated assembly processes.

GS7B035492JDT Applications

• Industrial Electronics: Ideal for signal conditioning, voltage dividers, and pull-up/down networks in control systems.
• Automotive (Non-Automotive Rated): Suitable for non-safety-critical applications like sensor interfaces.
• Test & Measurement: Precision resistance networks for calibration and instrumentation.
• Consumer Electronics: Used in audio equipment, displays, and power management circuits.
• Telecom Infrastructure: Reliable performance in filtering and impedance matching circuits.

Conclusion of GS7B035492JDT

The GS7B035492JDT excels in precision, thermal stability, and compactness, making it a versatile choice for industrial, telecom, and consumer applications. Its bussed architecture reduces component count, while the ceramic substrate ensures long-term reliability. Though not PPAP or automotive-qualified, it remains a cost-effective solution for non-critical, high-density designs. Engineers will appreciate its balance of performance and manufacturability in surface-mount assemblies.