TT Electronics/IRC

GS7B036980BBT

GS7B036980BBT Description

The GS7B036980BBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding applications requiring tight tolerance and stability. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 thin-film resistors, each with a resistance value of 698Ω and an absolute tolerance of ±0.1%. The device operates over a wide temperature range (70°C to 125°C) with a low temperature coefficient of ±25ppm/°C, ensuring minimal drift under thermal stress. Its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for precision analog and digital circuits. The SOIC-C series construction offers robust ceramic substrate reliability, while the gull-wing termination facilitates easy surface-mount assembly.

GS7B036980BBT Features

• Precision Performance: ±0.1% absolute tolerance and ±0.1% ratio tolerance for critical signal conditioning.
• Stable Thin-Film Technology: Delivers low noise and high linearity, ideal for precision instrumentation.
• Wide Operating Range: Rated for -55°C to +125°C (derated power up to 125°C).
• Compact & Robust: 8.66mm × 5.99mm × 1.45mm footprint with ±0.1mm length/height tolerances.
• High Voltage Handling: Supports up to 100V, suitable for industrial and automotive peripherals (non-automotive PPAP).
• Low TCR: ±25ppm/°C ensures stability across thermal cycles.
• Bussed Configuration: Simplifies PCB layout for common bus applications.

GS7B036980BBT Applications

• Precision Voltage Dividers: Used in ADC/DAC reference circuits and sensor interfaces.
• Medical Electronics: Patient monitoring systems requiring low-drift components.
• Test & Measurement Equipment: High-accuracy multimeters and calibration tools.
• Industrial Control Systems: PLCs and signal conditioning modules where stability is critical.
• Aerospace & Defense: Avionics and communication systems leveraging its ceramic ruggedness.

Conclusion of GS7B036980BBT

The GS7B036980BBT excels in environments demanding tight tolerance, thermal stability, and compact integration. Its ceramic substrate, thin-film technology, and bussed design provide a competitive edge over polymer-based networks, particularly in high-reliability sectors. While not PPAP-capable or automotive-grade, it remains a top choice for precision industrial, medical, and aerospace applications where performance outweighs cost considerations. Engineers will appreciate its repeatable accuracy and robust packaging, making it a dependable solution for critical circuit designs.