TT Electronics/IRC

GS7B038871BAT

GS7B038871BAT Description

The GS7B038871BAT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 14-pin narrow SOIC package, this bussed (BUS) configuration network integrates 13 thin-film resistors, each with a 0.1% absolute tolerance and a ±25ppm/°C temperature coefficient. The device offers a resistance value of 8.87KΩ and supports a maximum operating temperature of 125°C, with derated performance up to 70–125°C. Its 0.7W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for precision analog and digital circuits. The gull-wing termination and surface-mount design ensure reliable PCB integration.

GS7B038871BAT Features

• High Precision: ±0.1% absolute tolerance and ±0.05% ratio tolerance for critical signal conditioning.
• Stable Performance: ±25ppm/°C TCR ensures minimal drift across temperature variations.
• Robust Construction: Ceramic SOIC-C case provides excellent thermal and mechanical stability.
• Space-Efficient: Compact 8.66mm × 5.99mm × 1.45mm footprint with 1.27mm terminal pitch.
• Wide Voltage Range: Supports up to 100V, ideal for industrial and instrumentation applications.
• Reliable Termination: Gull-wing leads enhance solder joint integrity in automated assembly.

GS7B038871BAT Applications

This resistor network excels in:

• Precision voltage dividers and reference circuits in test/measurement equipment.
• Signal conditioning for sensors and ADCs in automotive (non-AECQ) and industrial systems.
• Feedback networks in high-accuracy op-amp and DAC configurations.
• Medical instrumentation where tight tolerance and low drift are critical.
• Telecom infrastructure for impedance matching and filtering.

Conclusion of GS7B038871BAT

The GS7B038871BAT stands out for its exceptional precision, thermal stability, and compact form factor, making it a top choice for engineers designing high-reliability circuits. While not PPAP or automotive-qualified, its thin-film technology and ceramic encapsulation deliver superior performance in industrial, medical, and telecom applications. For designs requiring ultra-low tolerance and minimal thermal drift, this network offers a compelling balance of performance and integration ease.