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GS8A012210FT
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GS8A012210FT Description
GS8A012210FT Description
The GS8A012210FT from TT Electronics/IRC is a high-performance 8-resistor thin-film network designed for precision applications requiring stable resistance and isolation. Housed in a 16-pin SOIC ceramic package, it offers a 221Ω resistance per resistor with a tight 1% tolerance and a low ±100ppm/°C temperature coefficient, ensuring reliable performance across a -70°C to +125°C operating range. With a 0.1W power rating per resistor (0.8W total) and 100V maximum voltage rating, this surface-mount (Gull Wing) network is ideal for compact, high-density PCB designs. Its ceramic case provides superior thermal and mechanical stability, while the isolated (ISOL) circuit design minimizes crosstalk. Packaged in tubes, it suits automated assembly processes.
GS8A012210FT Features
- Precision Thin Film Technology: Delivers stable resistance with ±100ppm/°C TCR and 1% tolerance for critical analog/digital circuits.
- Robust Ceramic Package: Enhances thermal dissipation and durability in harsh environments.
- Isolated Resistor Network (ISOL): Prevents signal interference, ideal for multi-channel systems.
- High Power Density: 0.8W total power (0.1W per resistor) in a compact 9.91mm × 5.99mm × 1.45mm footprint.
- Wide Temperature Range: Operates from -70°C to +125°C with derated power at elevated temperatures.
- Automation-Friendly: Gull Wing terminals and 1.27mm pitch simplify SMT assembly.
GS8A012210FT Applications
- Industrial Electronics: Signal conditioning, PLCs, and sensor interfaces requiring isolation.
- Telecom Infrastructure: Line termination, impedance matching, and RF modules.
- Medical Devices: Precision instrumentation where low drift and reliability are critical.
- Automotive (Non-Automotive Rated): Non-safety systems like infotainment or climate control.
- Test & Measurement Equipment: Calibration circuits and reference voltage dividers.
Conclusion of GS8A012210FT
The GS8A012210FT excels in applications demanding high precision, thermal stability, and compactness. Its ceramic SOIC package, isolated design, and thin-film technology make it superior to polymer-based networks in harsh environments. While not PPAP or automotive-qualified, it is a cost-effective solution for industrial, telecom, and medical designs. Engineers will appreciate its balance of performance, size, and reliability in space-constrained, high-accuracy circuits.



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