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GS8A012322GGT
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GS8A012322GGT Description
GS8A012322GGT Description
The GS8A012322GGT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications requiring stable resistance values and reliable isolation. This 8-resistor network features a 23.2K Ohm resistance per element with a tight 2% tolerance and a low ±100ppm/°C temperature coefficient, ensuring minimal drift across operating conditions. Housed in a 16-pin SOIC ceramic package, it offers excellent thermal stability and electrical isolation, making it ideal for harsh environments. The 0.8W total power rating (0.1W per resistor) and 100V maximum voltage rating provide robust performance in compact designs. Its gull-wing termination and surface-mount (SMD) compatibility facilitate easy PCB integration.
GS8A012322GGT Features
- Precision Thin Film Technology: Delivers stable resistance with low TCR (±100ppm/°C) and tight tolerance (±2%).
- High Isolation & Durability: Ceramic SOIC case ensures superior thermal and electrical isolation, suitable for 70°C to 125°C derated operation.
- Compact & Reliable: 9.91mm x 5.99mm x 1.45mm dimensions with ±0.1mm length/height tolerances for space-constrained designs.
- Optimized Power Handling: 0.8W total dissipation (0.1W per resistor) balances performance and thermal management.
- Automation-Friendly: Tube packaging and gull-wing leads streamline pick-and-place assembly.
GS8A012322GGT Applications
- Industrial Controls: Signal conditioning, feedback networks, and voltage division in PLCs and sensors.
- Medical Electronics: Precision analog circuits where stability and isolation are critical.
- Telecom Infrastructure: RF modules and filtering circuits requiring low drift.
- Test & Measurement Equipment: Calibration networks and reference circuits.
- Aerospace & Defense: Harsh-environment applications due to ceramic construction and wide temperature range.
Conclusion of GS8A012322GGT
The GS8A012322GGT excels in precision applications demanding low drift, high isolation, and compact form factors. Its ceramic SOIC package, thin-film technology, and robust power handling make it a superior choice over plastic-encapsulated networks in high-reliability systems. While not RoHS-compliant, its performance in industrial, medical, and aerospace sectors underscores its niche superiority. Engineers seeking a stable, high-voltage-resistant network will find this model optimally balanced for critical designs.



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