TT Electronics/IRC

GS8A0126R7FDT

GS8A0126R7FDT Description

The GS8A0126R7FDT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 8-resistor isolated network features a 26.7Ω resistance value with a tight 1% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). Housed in a 16-pin SOIC ceramic package, it offers 0.1W power rating per resistor (0.8W total) and a maximum voltage rating of 100V. Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the ceramic case enhances thermal and mechanical durability.

GS8A0126R7FDT Features

• Precision Thin Film Technology: Delivers high accuracy (±1%) and low TCR (±100ppm/°C) for stable operation.
• Isolated Circuit Design (ISOL): Each resistor is electrically independent, ideal for signal isolation.
• Robust Ceramic Package: Ensures superior thermal dissipation and mechanical strength.
• Compact SOIC-16 Form Factor: Space-saving 9.91mm × 5.99mm × 1.45mm dimensions with ±0.1mm length/height tolerances.
• Wide Operating Range: Suitable for harsh environments (-55°C to +125°C).
• Gull-Wing SMD Termination: Enables reliable soldering and automated assembly.

GS8A0126R7FDT Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers, feedback networks in op-amp circuits.
• Industrial Control Systems: Isolated measurement and sensor interfaces.
• Medical Electronics: High-reliability instrumentation requiring minimal drift.
• Telecommunications: Impedance matching and termination in RF modules.
• Automotive (Non-Automotive Qualified): Engine control units (ECUs) where temperature stability is critical.

Conclusion of GS8A0126R7FDT

The GS8A0126R7FDT stands out for its precision, isolation, and rugged ceramic construction, making it a superior choice for demanding electronics. While not PPAP or automotive-qualified, its thin-film technology and tight tolerances cater to industrial, medical, and telecom applications where reliability is paramount. Its compact SOIC package and high power density further enhance its versatility in space-constrained designs.