TT Electronics/IRC

GS8A013901BT

GS8A013901BT Description

The GS8A013901BT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding isolation and signal conditioning applications. This 8-resistor array features a 3.9K Ohm resistance per element with an ultra-tight 0.1% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). Housed in a 16-pin SOIC ceramic package, it offers 0.8W total power dissipation (0.1W per resistor) and a 100V maximum voltage rating, making it suitable for high-reliability circuits. The gull-wing termination and surface-mount design facilitate easy PCB integration, while its isolated (ISOL) circuit configuration enhances signal integrity in noise-sensitive environments.

GS8A013901BT Features

• Precision Thin Film Technology: Delivers 0.1% tolerance and ±100ppm/°C TCR for minimal drift.
• Robust Construction: Ceramic SOIC case ensures durability and thermal stability.
• High Power Handling: 0.8W total (0.1W per resistor) with derating up to 125°C.
• Isolated Design (ISOL): Prevents crosstalk in multi-channel systems.
• Surface-Mount Ready: Gull-wing leads and 1.27mm pitch for automated assembly.
• Compact Dimensions: 9.91mm × 5.99mm × 1.45mm with tight tolerances (±0.1mm height/length).
• Non-Automotive/Non-PPAP: Ideal for industrial and telecom applications.

GS8A013901BT Applications

This resistor network excels in:

• Precision Analog Circuits: Voltage dividers, feedback networks, and DAC/ADC interfaces.
• Isolation Modules: Signal conditioning in medical equipment or test instrumentation.
• Telecom Infrastructure: Line drivers, impedance matching, and RF front-end circuits.
• Industrial Control Systems: PLCs, sensor interfaces, and power management.
• High-Temperature Environments: Oil/gas monitoring or aerospace systems (up to 125°C).

Conclusion of GS8A013901BT

The GS8A013901BT stands out for its combination of precision, isolation, and power handling in a compact SOIC package. Its ceramic construction and thin-film technology make it a superior choice over bulkier or less stable alternatives (e.g., thick-film networks). While not PPAP-capable, it is ideal for high-reliability industrial, telecom, and instrumentation designs requiring tight tolerances and thermal resilience. Engineers will appreciate its ease of integration and consistent performance in noise-critical applications.