TT Electronics/IRC

GS8A0175R0DT

GS8A0175R0DT Description

The GS8A0175R0DT from TT Electronics/IRC is a high-precision 8-resistor isolated network in a 16-pin narrow SOIC package. Designed with thin-film technology on a ceramic substrate, it delivers exceptional stability with a ±0.5% tolerance and a low ±100ppm/°C temperature coefficient. Each resistor offers 75Ω resistance with a 0.1W (1/10W) power rating per element (0.8W total), operating reliably from 70°C to 125°C at derated power. The 100V maximum voltage rating and gull-wing termination make it suitable for surface-mount applications requiring tight space constraints. The 9.91mm × 5.99mm × 1.45mm package features ±0.1mm length/height and ±0.2mm depth tolerances, ensuring consistent PCB compatibility.

GS8A0175R0DT Features

• Isolated Circuit Design: Each of the 8 resistors is electrically independent, ideal for precision signal routing.
• High Stability: Ceramic case and thin-film technology ensure minimal drift under thermal stress.
• Tight Tolerance: ±0.5% absolute tolerance for critical analog/digital applications.
• Wide Operating Range: Supports -55°C to +125°C (full power up to 70°C).
• Robust Construction: SOIC-C series ceramic package enhances durability in harsh environments.
• Low TCR: ±100ppm/°C ensures consistent performance across temperature fluctuations.

GS8A0175R0DT Applications

This resistor network excels in:

• Precision voltage dividers in test/measurement equipment.
• Signal conditioning for industrial sensors and ADCs/DACs.
• Medical devices requiring stable, high-accuracy resistance paths.
• Automotive subsystems (non-AECQ qualified) like infotainment or climate control.
• Aerospace instrumentation where ceramic packages mitigate thermal expansion issues.

Conclusion of GS8A0175R0DT

The GS8A0175R0DT stands out for its isolated thin-film resistors, ceramic robustness, and sub-1% tolerance, making it a superior choice over polymer-based networks in precision applications. While not PPAP or automotive-qualified, its 125°C rating and low TCR suit demanding industrial and embedded systems. Engineers benefit from its space-saving SOIC footprint and reliable performance in thermally variable environments.