


TT Electronics/IRC
GS8A0180R6GFT
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GS8A0180R6GFT Description
GS8A0180R6GFT Description
The GS8A0180R6GFT from TT Electronics/IRC is a high-performance 8-resistor thin-film network designed for precision applications requiring stable resistance characteristics. Housed in a 16-pin SOIC ceramic package, it offers 80.6Ω resistance per resistor with a tight 2% tolerance and a low ±100ppm/°C temperature coefficient, ensuring reliable performance across a wide temperature range (70°C to 125°C). The isolated (ISOL) circuit design allows independent resistor operation, making it ideal for signal conditioning, voltage division, and impedance matching. With a 0.8W total power rating (0.1W per resistor) and a 100V maximum voltage rating, this network is suited for demanding industrial and instrumentation applications.
GS8A0180R6GFT Features
- High Precision: Thin-film technology ensures low tolerance (±2%) and excellent TCR (±100ppm/°C).
- Robust Construction: Ceramic SOIC package provides superior thermal stability and mechanical durability.
- Isolated Resistors: Independent resistors (ISOL) enable flexible circuit configurations.
- Surface-Mount Design: Gull-wing terminals and 1.27mm pitch simplify PCB assembly.
- Wide Operating Range: Rated for -55°C to +125°C, derated up to 125°C.
- Compact Dimensions: 9.91mm × 5.99mm × 1.45mm (L×D×H) with tight tolerances (±0.1mm).
GS8A0180R6GFT Applications
- Industrial Electronics: Precision voltage dividers, feedback networks in control systems.
- Test & Measurement: Calibration circuits, sensor signal conditioning.
- Telecommunications: Impedance matching in RF and high-frequency circuits.
- Medical Devices: Low-noise analog signal processing.
- Automotive (Non-Automotive Rated): Prototyping or non-safety-critical circuits.
Conclusion of GS8A0180R6GFT
The GS8A0180R6GFT stands out for its precision, isolation, and ceramic-based reliability, making it a superior choice for applications demanding stable resistance under thermal stress. While not PPAP or automotive-qualified, its thin-film technology and compact SOIC package offer a compelling solution for industrial, medical, and telecom designs. Engineers will appreciate its balance of performance, durability, and ease of integration in space-constrained PCBs.



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