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GS8A0190R9FFT
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GS8A0190R9FFT Description
GS8A0190R9FFT Description
The GS8A0190R9FFT from TT Electronics/IRC is a high-performance 8-resistor isolated network in a 16-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 90.9Ω resistance value and ±1% absolute tolerance, this ceramic-based network ensures reliable signal conditioning and voltage division. Its isolated circuit design (ISOL) allows independent resistor operation, enhancing flexibility in complex PCB layouts. The device operates across a -70°C to +125°C temperature range, maintaining a ±100ppm/°C temperature coefficient for minimal drift. Rated at 0.1W per resistor (0.8W total) and 100V maximum voltage, it suits demanding environments.
GS8A0190R9FFT Features
- Precision Thin Film Technology: Delivers stable performance with ±1% tolerance and low TCR (±100ppm/°C).
- Isolated Resistor Network: Eight independent resistors in a SOIC-16 package, ideal for modular designs.
- Robust Construction: Ceramic substrate ensures thermal stability and durability under high-temperature conditions (up to 125°C).
- Surface-Mount Gull Wing Terminals: Facilitates automated PCB assembly with 1.27mm pitch for high-density layouts.
- Non-Automotive, Non-PPAP: Suitable for industrial and commercial applications where automotive-grade certification isn’t required.
- Compact Dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).
GS8A0190R9FFT Applications
- Signal Conditioning: Precision voltage dividers in sensor interfaces and ADC/DAC circuits.
- Medical Electronics: Isolated feedback networks in diagnostic equipment.
- Industrial Control Systems: Current-limiting and impedance matching in PLCs.
- Test & Measurement: Calibration circuits requiring low drift and high accuracy.
- Telecommunications: Line termination and impedance balancing in high-frequency modules.
Conclusion of GS8A0190R9FFT
The GS8A0190R9FFT excels in applications demanding high precision, thermal stability, and isolation. Its ceramic construction and thin-film technology offer superior performance over standard thick-film networks, while the SOIC package ensures compatibility with modern SMT processes. Though not RoHS-compliant, it remains a cost-effective solution for industrial and telecom systems where reliability outweighs regulatory constraints. Engineers will appreciate its balance of accuracy, power handling, and compact form factor in space-constrained designs.



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