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GS8A021200FDT
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GS8A021200FDT Description
GS8A021200FDT Description
The GS8A021200FDT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 8-resistor isolated network features a 120Ω resistance value per resistor with a tight 1% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Housed in a 16-pin SOIC ceramic package, it offers excellent thermal stability and durability. The 0.1W (1/10W) power rating per resistor and 0.8W total power rating make it suitable for moderate power dissipation requirements. Its 100V maximum voltage rating and gull-wing SMD termination ensure reliable surface-mount integration in compact PCB designs.
GS8A021200FDT Features
- Precision Thin Film Technology: Delivers high accuracy (±1%) and low TCR (±50ppm/°C) for stable performance.
- Isolated Resistor Network (ISOL): Each resistor operates independently, reducing crosstalk in sensitive circuits.
- Robust Ceramic SOIC Package: Enhances thermal management and mechanical strength in harsh environments.
- Surface-Mount Gull Wing Terminals: Facilitates automated PCB assembly with a 1.27mm terminal pitch.
- Wide Operating Range: Rated for -55°C to +125°C, with derated power up to 125°C.
- Compact Dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D).
GS8A021200FDT Applications
This resistor network is ideal for:
- Analog Signal Conditioning: Precision voltage dividers, feedback networks in op-amp circuits.
- Industrial Control Systems: Isolated sensor interfaces, PLCs, and instrumentation.
- Medical Electronics: Patient monitoring equipment requiring high reliability.
- Telecommunications: Impedance matching and termination in high-frequency modules.
- Automotive (Non-Automotive Rated): Prototyping or non-safety-critical circuits where ceramic durability is advantageous.
Conclusion of GS8A021200FDT
The GS8A021200FDT excels in applications demanding precision, isolation, and thermal stability. Its ceramic SOIC package and thin-film technology provide superior performance over standard thick-film networks, particularly in environments with fluctuating temperatures or stringent accuracy requirements. While not PPAP or automotive-qualified, it remains a cost-effective solution for industrial, medical, and telecom designs. Engineers will appreciate its balance of compactness, power handling, and reliability, making it a versatile choice for advanced electronic systems.



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