TT Electronics/IRC

GS8A021403GFT

GS8A021403GFT Description

The GS8A021403GFT from TT Electronics/IRC is a high-performance 8-resistor thin film network designed for precision applications. Housed in a 16-pin SOIC ceramic package, it offers 140K Ohm resistance per resistor with a tight 2% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). The isolated (ISOL) circuit design provides electrical separation between resistors, making it ideal for signal conditioning and voltage division tasks. With a 0.8W total power rating (0.1W per resistor) and 100V maximum voltage rating, this surface-mount (SMD) network is engineered for reliability in demanding environments. Its gull wing termination and 1.27mm terminal pitch facilitate easy PCB integration.

GS8A021403GFT Features

• Precision Thin Film Technology: Delivers low noise and high stability.
• Ceramic SOIC Package: Enhances thermal performance and durability.
• Isolated Resistors (ISOL): Independent resistors for flexible circuit design.
• Wide Operating Range: -70°C to +125°C with derated power up to 125°C.
• Low TCR (±50ppm/°C): Minimizes resistance drift under temperature fluctuations.
• Compact Dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm).
• RoHS Non-Compliant: Suitable for legacy or specialized applications.

GS8A021403GFT Applications

This resistor network excels in:

• Analog Signal Processing: Voltage dividers, feedback networks in op-amp circuits.
• Industrial Controls: Precision instrumentation, sensor interfacing.
• Telecommunications: Impedance matching, line termination.
• Medical Electronics: High-reliability systems requiring stable resistance values.
• Automotive (Non-Automotive Rated): Prototyping or non-safety-critical circuits.

Conclusion of GS8A021403GFT

The GS8A021403GFT combines precision, isolation, and ruggedness in a compact SOIC package, making it a standout choice for engineers needing reliable thin film networks. Its ceramic construction, low TCR, and high power density cater to applications demanding tight tolerances and thermal stability. While not PPAP or automotive-qualified, it remains a robust solution for industrial, telecom, and medical designs where performance outweighs compliance requirements.