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GS8A022552BAT
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GS8A022552BAT Description
GS8A022552BAT Description
The GS8A022552BAT from TT Electronics/IRC is a high-precision 8-resistor network designed for demanding isolation and signal conditioning applications. Housed in a 16-pin narrow SOIC ceramic package, it features isolated thin-film resistors with a tight tolerance of ±0.1% and an ultra-stable ±50ppm/°C temperature coefficient. Each resistor offers a 25.5KΩ value, rated for 0.1W (1/10W) power dissipation per element and a 100V maximum voltage rating. The device operates across a wide temperature range of -70°C to +125°C, ensuring reliability in harsh environments. Its gull-wing termination and surface-mount design facilitate automated assembly, while the ceramic case enhances thermal and mechanical stability.
GS8A022552BAT Features
- Precision Performance: ±0.1% absolute tolerance and ±0.05% ratio tolerance for critical analog circuits.
- Robust Construction: Ceramic SOIC package with 9.91mm × 5.99mm × 1.45mm dimensions (±0.1mm length/height tolerance).
- High Stability: Thin-film technology with ±50ppm/°C TCR minimizes drift over temperature.
- Isolated Design: Independent resistors (no common node) for flexible circuit integration.
- Automation-Friendly: 1.27mm terminal pitch and surface-mount gull-wing leads for efficient PCB assembly.
- Wide Operating Range: Derated power up to 125°C, suitable for industrial and automotive-adjacent applications (non-Automotive PPAP).
GS8A022552BAT Applications
Ideal for precision voltage dividers, feedback networks, and isolation circuits in:
- Medical Equipment: Patient monitoring systems requiring stable signal conditioning.
- Test & Measurement: High-accuracy instrumentation and calibration tools.
- Industrial Controls: Isolated sensor interfaces and PLCs operating in extreme temperatures.
- Telecom Infrastructure: Signal processing modules where low drift is critical.
- Aerospace & Defense: Ruggedized electronics needing ceramic-packaged reliability.
Conclusion of GS8A022552BAT
The GS8A022552BAT excels in applications demanding precision, stability, and isolation. Its ceramic SOIC package, thin-film resistors, and tight tolerances make it a superior choice over plastic-encapsulated networks in high-reliability environments. While not PPAP-capable for automotive use, it is well-suited for industrial, medical, and aerospace designs where long-term performance under thermal stress is paramount. Engineers will value its repeatable accuracy and mechanical robustness in mission-critical circuits.



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