TT Electronics/IRC

GS8A022871FBT

GS8A022871FBT Description

The GS8A022871FBT from TT Electronics/IRC is a high-performance 8-resistor thin film network designed for precision applications. Encased in a 16-pin SOIC ceramic package, it offers 2.87KΩ resistance per resistor with a tight 1% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stability across a wide operating temperature range of -70°C to +125°C. The isolated (ISOL) circuit design provides independent resistors, making it ideal for applications requiring electrical separation. With a 0.1W power rating per resistor (0.8W total) and a 100V maximum voltage rating, this device balances power handling and compactness in a surface-mount (SMD) gull-wing termination format. Its ceramic construction enhances thermal and mechanical reliability, while the 9.91mm x 5.99mm x 1.45mm footprint suits space-constrained designs.

GS8A022871FBT Features

• Precision Thin Film Technology: Delivers stable performance with ±50ppm/°C TCR and 1% tolerance.
• Isolated Resistor Network: Eight independent 2.87KΩ resistors in a single package for flexible circuit design.
• High-Temperature Operation: Rated for 125°C maximum temperature, derated up to 70°C.
• Robust Ceramic Package: Enhances durability and thermal management vs. plastic alternatives.
• Surface-Mount SOIC-16: Gull-wing leads with 1.27mm pitch for easy PCB integration.
• Low Power Dissipation: 0.1W per resistor (0.8W total) suits energy-sensitive applications.
• Non-Automotive/Non-PPAP: Optimized for industrial, telecom, and instrumentation use.

GS8A022871FBT Applications

• Precision Voltage Dividers: Isolated resistors ensure accurate signal conditioning in measurement systems.
• Medical Electronics: Stable performance in diagnostic equipment due to low TCR and high reliability.
• Telecom Infrastructure: Signal termination and impedance matching in high-frequency circuits.
• Industrial Control Systems: Robust ceramic package withstands harsh environments.
• Test & Measurement Equipment: Tight tolerance and isolation reduce calibration drift.

Conclusion of GS8A022871FBT

The GS8A022871FBT excels in applications demanding precision, isolation, and thermal resilience. Its thin film technology, ceramic housing, and SOIC-16 footprint make it a superior choice over plastic-packaged networks for high-reliability industrial and telecom systems. While not PPAP-capable or automotive-grade, its performance-to-size ratio and electrical isolation justify its use in mission-critical electronics. Engineers should consider this model for designs prioritizing long-term stability, space efficiency, and signal integrity.