TT Electronics/IRC

GS8A022871JT

GS8A022871JT Description

The GS8A022871JT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications requiring stable resistance values and reliable isolation. This 8-resistor network features a 2.87KΩ resistance per element with a 5% tolerance and a ±50ppm/°C temperature coefficient, ensuring consistent performance across a wide temperature range (70°C to 125°C). Housed in a 16-pin SOIC ceramic package, it offers 0.1W power dissipation per resistor (0.8W total) and a 100V maximum voltage rating, making it suitable for demanding environments. The gull-wing termination and surface-mount design facilitate easy PCB integration, while its isolated (ISOL) circuit design enhances signal integrity in multi-channel systems.

GS8A022871JT Features

• High Precision: Thin-film technology delivers low TCR (±50ppm/°C) and tight tolerance (5%).
• Robust Construction: Ceramic case ensures durability and thermal stability.
• Space-Efficient: Compact SOIC-16 package (9.91mm × 5.99mm × 1.45mm) with 1.27mm terminal pitch.
• Isolated Design: ISOL circuit configuration minimizes crosstalk for critical analog/digital applications.
• Wide Operating Range: Rated for -55°C to +125°C with derated power up to 125°C.
• Reliable Termination: Gull-wing leads provide secure soldering and mechanical strength.

GS8A022871JT Applications

Ideal for precision electronics where stability and isolation are paramount, including:

• Analog Signal Conditioning: Voltage dividers, sensor interfaces.
• Industrial Controls: PLCs, instrumentation amplifiers.
• Medical Devices: Patient monitoring systems, diagnostic equipment.
• Telecommunications: Line drivers, impedance matching networks.
• Automotive (Non-Automotive Rated): Infotainment systems, non-safety-critical circuits.

Conclusion of GS8A022871JT

The GS8A022871JT excels in applications demanding high accuracy, thermal resilience, and electrical isolation. Its ceramic SOIC package and thin-film technology offer superior performance over carbon or thick-film alternatives, particularly in environments with fluctuating temperatures or stringent signal integrity requirements. While not PPAP or automotive-qualified, it remains a cost-effective solution for industrial, medical, and telecom systems. Engineers will appreciate its balance of precision, power handling, and compact form factor, making it a versatile choice for modern PCB designs.