TT Electronics/IRC

GS8A023900CT

GS8A023900CT Description

The GS8A023900CT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding isolation applications. This 8-resistor array features a 390Ω resistance per element with an ultra-tight ±0.25% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stable performance across a wide -70°C to +125°C operating range. Housed in a 16-pin SOIC ceramic package, it offers 0.1W (1/10W) power dissipation per resistor (0.8W total), making it suitable for compact, high-density PCB designs. The gull-wing termination and 1.27mm pitch facilitate reliable surface-mount assembly, while its 100V maximum voltage rating enhances robustness in industrial and instrumentation circuits.

GS8A023900CT Features

• Precision Performance: Thin-film technology delivers 0.25% tolerance and ±50ppm/°C TCR for critical analog/digital signal conditioning.
• Isolation-Centric Design: Isolated (ISOL) circuit configuration minimizes crosstalk, ideal for differential signaling or voltage division.
• Robust Construction: Ceramic SOIC case ensures thermal stability and mechanical durability in harsh environments.
• Space-Efficient: Compact 9.91mm × 5.99mm × 1.45mm footprint with 16-pin gull-wing SMD termination.
• Wide Operating Range: Derated power capability up to 125°C, suited for extended industrial use.

GS8A023900CT Applications

• Medical Equipment: Precision voltage dividers in patient monitoring systems.
• Industrial Automation: Signal isolation in PLCs, motor drives, and sensor interfaces.
• Test & Measurement: High-accuracy reference networks for data acquisition modules.
• Telecommunications: Impedance matching and termination in RF/analog circuits.
• Automotive (Non-Automotive Rated): Prototyping or non-safety-critical ECU designs.

Conclusion of GS8A023900CT

The GS8A023900CT excels in applications demanding high precision, thermal stability, and electrical isolation. Its ceramic SOIC package and thin-film technology provide superior performance over plastic-encapsulated alternatives, particularly in environments with fluctuating temperatures or stringent accuracy requirements. While not PPAP or automotive-qualified, it remains a cost-effective solution for industrial, medical, and telecom systems where reliability and miniaturization are paramount. Engineers will appreciate its balance of tight tolerances, power handling, and compact form factor in space-constrained designs.