TT Electronics/IRC

GS8A023902JT

GS8A023902JT Description

The GS8A023902JT from TT Electronics/IRC is a high-performance 8-resistor thin-film network designed for precision applications requiring stable resistance and thermal performance. Housed in a 16-pin SOIC ceramic package, it offers 39KΩ resistance per resistor with a 5% tolerance and ±50ppm/°C temperature coefficient, ensuring reliable operation across a -70°C to +125°C temperature range. The isolated (ISOL) circuit design eliminates crosstalk between resistors, making it ideal for signal conditioning and voltage division. With a 0.1W power rating per resistor (0.8W total) and 100V maximum voltage rating, this surface-mount device (SMD) combines durability with compactness, featuring gull-wing terminals for secure PCB mounting.

GS8A023902JT Features

• Ceramic SOIC Package: Enhances thermal stability and mechanical robustness in harsh environments.
• Thin-Film Technology: Delivers low noise, high accuracy (±5%), and tight TCR (±50ppm/°C) for precision circuits.
• Isolated Resistors: Independent resistors prevent interference, suitable for multi-channel systems.
• Wide Temperature Range: Operates reliably from -70°C to +125°C with derated power up to 125°C.
• High Voltage Handling: Supports up to 100V, ideal for industrial and automotive (non-Automotive PPAP) applications.
• Compact Dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).

GS8A023902JT Applications

• Signal Conditioning: Isolated resistors ensure clean signal paths in sensor interfaces or ADC/DAC circuits.
• Voltage Division: Precision dividers in test equipment or power management systems.
• Industrial Controls: Stable performance in PLCs, motor drives, and instrumentation.
• Medical Devices: Low-noise, high-reliability operation for diagnostic equipment.
• Telecom Infrastructure: Suitable for RF modules and baseband processing where thermal drift is critical.

Conclusion of GS8A023902JT

The GS8A023902JT excels in applications demanding precision, isolation, and thermal resilience. Its ceramic SOIC package and thin-film technology provide superior performance over plastic-encapsulated networks, while the isolated design ensures signal integrity. Though not PPAP-compliant for automotive use, it is a cost-effective solution for industrial, medical, and telecom systems requiring high-voltage tolerance and tight TCR. The tube packaging facilitates automated assembly, making it a practical choice for high-volume production.