TT Electronics/IRC

GS8A027870GFT

GS8A027870GFT Description

The GS8A027870GFT from TT Electronics/IRC is a high-performance 8-resistor thin-film network designed for precision applications. Housed in a 16-pin SOIC ceramic package, it features 787Ω resistance per element with a tight 2% tolerance and ±50ppm/°C temperature coefficient, ensuring stable performance across a -70°C to +125°C operating range. The 0.1W power rating per resistor (0.8W total) and 100V maximum voltage rating make it suitable for demanding circuits. Its isolated (ISOL) circuit design, gull-wing termination, and surface-mount compatibility (SOIC-16) enable reliable integration into compact PCB layouts. The ceramic case enhances thermal stability, while the thin-film technology delivers low noise and high accuracy.

GS8A027870GFT Features

• Precision Network: 8 resistors, each 787Ω ±2%, with ±50ppm/°C TCR for minimal drift.
• Robust Construction: Ceramic SOIC package ensures durability and heat dissipation.
• High Power Handling: 0.8W total power (0.1W per resistor) at 125°C max temperature.
• Isolated Design (ISOL): Independent resistors reduce crosstalk in critical circuits.
• Surface-Mount Ready: Gull-wing leads and 1.27mm pitch for easy SMD assembly.
• Stable Performance: Thin-film technology offers low noise and long-term reliability.
• Compact Dimensions: 9.91mm × 5.99mm × 1.45mm (±0.1mm tolerance) for space-constrained designs.

GS8A027870GFT Applications

• Industrial Electronics: Signal conditioning, feedback networks, and precision dividers.
• Test & Measurement Equipment: High-accuracy reference circuits and calibration systems.
• Medical Devices: Isolated sensor interfaces and analog signal processing.
• Automotive (Non-Automotive Rated): Diagnostic modules and control systems (where PPAP is not required).
• Telecommunications: Impedance matching and RF front-end circuits.

Conclusion of GS8A027870GFT

The GS8A027870GFT excels in precision analog applications requiring stable resistance, low TCR, and isolation. Its ceramic SOIC package and thin-film technology provide superior thermal and electrical performance compared to polymer-based networks. While not PPAP or automotive-qualified, it is ideal for industrial, medical, and telecom systems demanding tight tolerances and reliability. Engineers will value its balance of power handling, compactness, and accuracy in high-density designs.