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GS8A031300FCT
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GS8A031300FCT Description
GS8A031300FCT Description
The GS8A031300FCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications requiring stable resistance values and low thermal drift. Housed in a 16-pin narrow SOIC package, this 8-resistor isolated network features 130Ω resistance per element with a tight ±1% absolute tolerance and ±0.25% ratio tolerance, ensuring exceptional accuracy in signal conditioning and voltage division circuits. Its thin-film technology and ±25ppm/°C temperature coefficient deliver superior stability across a wide operating temperature range of 70°C to 125°C, making it suitable for demanding environments. The SOIC-C series construction offers robust ceramic case insulation, ideal for isolating high-voltage signals up to 100V.
GS8A031300FCT Features
- Precision Performance: Thin-film resistors with ±1% tolerance and ±0.25% ratio tolerance for critical analog applications.
- Thermal Stability: ±25ppm/°C TCR minimizes resistance drift under temperature fluctuations.
- High Voltage Isolation: Ceramic SOIC package withstands up to 100V, ensuring reliable operation in high-voltage circuits.
- Compact & Durable: 9.91mm × 5.99mm footprint with 1.45mm profile, optimized for space-constrained PCBs.
- Surface-Mount Design: Gull-wing terminals with 1.27mm pitch for easy automated assembly.
- Power Handling: 0.1W per resistor (0.8W total) derated at elevated temperatures.
GS8A031300FCT Applications
- Industrial Electronics: Precision voltage dividers in PLCs, sensor interfaces, and test equipment.
- Medical Devices: Signal isolation in patient monitoring systems where accuracy is critical.
- Automotive (Non-Automotive Rated): Auxiliary circuits in infotainment or HVAC control modules (note: not PPAP/automotive-qualified).
- Telecom Infrastructure: Impedance matching in RF and baseband circuitry.
- Power Management: Feedback networks in DC-DC converters requiring stable resistance ratios.
Conclusion of GS8A031300FCT
The GS8A031300FCT excels in applications demanding high precision, thermal resilience, and compact form factors. Its ceramic isolation, low TCR, and tight tolerances make it a standout choice over plastic-encapsulated networks, particularly in environments with voltage spikes or thermal stress. While not automotive-grade, its reliability suits industrial, medical, and telecom designs where consistent performance is paramount. Engineers will appreciate its balance of miniaturization, power handling, and electrical robustness in critical circuits.



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