TT Electronics/IRC

GS8A031403DT

GS8A031403DT Description

The GS8A031403DT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin narrow SOIC package features 8 isolated thin-film resistors, each with a 140KΩ resistance and an ultra-tight ±0.5% tolerance. Operating within a wide temperature range of 70°C to 125°C, it delivers stable performance under derated power conditions. The device boasts a ±25ppm/°C temperature coefficient, ensuring minimal resistance drift. With a 100V maximum voltage rating and 0.1W power rating per resistor (0.8W total), it is engineered for reliability in precision circuits. The gull-wing termination and surface-mount design (SOIC package) facilitate easy PCB integration, while its ceramic case enhances thermal and mechanical durability.

GS8A031403DT Features

• High Precision: ±0.5% absolute tolerance and ±25ppm/°C TCR for stable performance.
• Robust Construction: Ceramic case (SOIC) with 9.91mm x 5.99mm x 1.45mm dimensions (±0.1mm length/height tolerance).
• Isolated Resistors: 8 independent 140KΩ elements, eliminating crosstalk in critical circuits.
• Wide Operating Range: Rated for 125°C max temperature and 70°C–125°C derated power range.
• Surface-Mount Ready: Gull-wing terminals with 1.27mm pitch for automated assembly.
• Low Power Dissipation: 0.1W per resistor (0.8W total) at 100V max voltage.
• Non-Automotive: Suitable for industrial, medical, and telecom applications requiring precision.

GS8A031403DT Applications

• Precision Analog Circuits: Voltage dividers, feedback networks, and sensor interfaces.
• Medical Electronics: Patient monitoring equipment where stability is critical.
• Test & Measurement: Calibration devices and high-accuracy instrumentation.
• Industrial Controls: PLCs and signal conditioning modules in harsh environments.
• Telecom Infrastructure: RF and baseband signal processing requiring low drift.

Conclusion of GS8A031403DT

The GS8A031403DT excels in applications demanding high precision, thermal stability, and isolation. Its ceramic SOIC package and thin-film technology provide superior performance over plastic-encased networks, particularly in elevated temperatures. While not PPAP or automotive-qualified, it is ideal for industrial, medical, and telecom systems where tight tolerances and reliability are paramount. Engineers will appreciate its ease of integration and consistent performance in critical designs.