TT Electronics/IRC

GS8A031802JFT

GS8A031802JFT Description

The GS8A031802JFT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 8-resistor isolated network features an 18K Ohm resistance value with a 5% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). Housed in a 16-pin SOIC ceramic package, it offers 0.8W total power dissipation (0.1W per resistor) and a maximum voltage rating of 100V. Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the ceramic case enhances thermal and mechanical durability.

GS8A031802JFT Features

• High Precision: Thin-film technology ensures low TCR (±25ppm/°C) and tight tolerance (±5%).
• Robust Construction: Ceramic SOIC package provides excellent thermal stability and mechanical strength.
• Isolated Design: Independent resistors (ISOL configuration) for flexible circuit design.
• Compact & Reliable: 9.91mm x 5.99mm x 1.45mm dimensions with tight tolerances (±0.1mm length/height, ±0.2mm depth).
• Wide Operating Range: Suitable for -55°C to +125°C environments, derated up to 125°C.
• Automotive-Grade Alternatives: While not PPAP-certified, its durability makes it viable for industrial and telecom applications.

GS8A031802JFT Applications

Ideal for precision analog circuits, signal conditioning, and voltage division, this resistor network excels in:

• Industrial Control Systems: Stable performance in harsh environments.
• Telecommunications Equipment: Low noise and high reliability for signal processing.
• Medical Devices: Consistent accuracy in diagnostic and monitoring systems.
• Test & Measurement Instruments: Minimal drift ensures long-term calibration integrity.

Conclusion of GS8A031802JFT

The GS8A031802JFT stands out for its precision, isolation, and ceramic-enhanced durability, making it a superior choice for demanding electronics. While not RoHS-compliant or automotive-grade, its thin-film technology and robust packaging cater to industrial, telecom, and medical applications where stability and compactness are critical. Engineers will appreciate its balance of performance and reliability in high-temperature, precision-centric designs.