TT Electronics/IRC

GS8A033902JT

GS8A033902JT Description

The GS8A033902JT from TT Electronics/IRC is a high-performance 8-resistor thin-film network designed for precision applications requiring stable resistance values under varying thermal conditions. Housed in a 16-pin SOIC ceramic package, this 39K Ohm ±5% network offers ±25ppm/°C temperature coefficient and 0.1W power rating per resistor (0.8W total), ensuring reliable operation in demanding environments. Its isolated (ISOL) circuit design, 100V maximum voltage rating, and surface-mount gull-wing termination make it suitable for compact, high-density PCB layouts. The ceramic case enhances thermal stability, while the SOIC package (9.91mm × 5.99mm × 1.45mm) ensures compatibility with automated assembly processes.

GS8A033902JT Features

• Precision Thin Film Technology: Delivers low TCR (±25ppm/°C) and tight tolerance (±5%) for stable performance.
• Robust Ceramic Package: Ensures superior thermal management and mechanical durability.
• High Power Handling: 0.8W total power dissipation (0.1W per resistor) at 70–125°C derated range.
• Isolated Resistor Network: Independent resistors minimize crosstalk in sensitive circuits.
• Surface-Mount Design: Gull-wing terminals with 1.27mm pitch for reliable soldering and reflow compatibility.
• Wide Voltage Rating: Supports up to 100V, ideal for industrial and instrumentation applications.

GS8A033902JT Applications

• Industrial Control Systems: Signal conditioning, voltage division, and feedback networks.
• Test & Measurement Equipment: Precision dividers and calibration circuits.
• Medical Electronics: Isolated signal paths in diagnostic devices.
• Automotive Electronics (non-AECQ): Sensor interfaces and ECU peripherals (though not PPAP/automotive-qualified).
• Telecom Infrastructure: Line termination and impedance matching in high-frequency modules.

Conclusion of GS8A033902JT

The GS8A033902JT excels in applications demanding high stability, isolation, and power efficiency in a compact footprint. Its ceramic construction, thin-film accuracy, and SOIC compatibility make it a standout choice for engineers prioritizing reliability in harsh environments. While not RoHS-compliant or automotive-grade, its performance-to-size ratio and thermal resilience position it as a versatile solution for industrial, medical, and telecom designs.