TT Electronics/IRC

GS8A034872DBT

GS8A034872DBT Description

The GS8A034872DBT from TT Electronics/IRC is a high-precision 8-resistor network in a 16-pin narrow SOIC package, designed for isolated (ISOL) circuit applications. Built with thin-film technology on a ceramic substrate, it offers excellent stability with a ±25ppm/°C temperature coefficient and ±0.5% absolute tolerance. Each resistor features a 48.7KΩ value, rated for 0.1W (1/10W) power dissipation per element (0.8W total). The SOIC-C series construction ensures robust performance in surface-mount applications, with a 100V maximum voltage rating and 125°C maximum operating temperature. Its gull-wing termination and 1.27mm terminal pitch facilitate reliable PCB assembly.

GS8A034872DBT Features

• Precision Performance: ±0.5% tolerance and ±0.1% ratio tolerance for critical analog/digital signal conditioning.
• High-Temperature Stability: Operates from 70°C to 125°C with derated power, ideal for harsh environments.
• Compact & Durable: Ceramic case (9.91mm x 5.99mm x 1.45mm) with ±0.1mm height/length tolerances ensures mechanical reliability.
• Isolated Design: Independent resistors (non-bussed) for flexible circuit integration.
• Low TCR: ±25ppm/°C minimizes resistance drift over temperature.

GS8A034872DBT Applications

• Precision Voltage Dividers: Used in ADC/DAC reference circuits and sensor interfaces.
• Medical/Industrial Electronics: Stable performance in patient monitoring or process control systems.
• Automotive & Aerospace (non-AECQ): Non-automotive but suitable for avionics or telematics where precision is critical.
• Test & Measurement Equipment: Calibration networks requiring low drift and high accuracy.

Conclusion of GS8A034872DBT

The GS8A034872DBT excels in high-accuracy, isolated resistor networks, combining thin-film precision, ceramic durability, and wide-temperature operation. While not PPAP or RoHS compliant, its 0.5% tolerance and low TCR make it a standout for precision analog designs. Ideal for industrial, medical, and instrumentation applications demanding stable performance under thermal stress. For engineers prioritizing tight tolerances and reliability, this network offers a compelling solution over standard bussed arrays.