TT Electronics/IRC

GS8A0366R5FDT

GS8A0366R5FDT Description

The GS8A0366R5FDT from TT Electronics/IRC is a high-precision 8-resistor network in a 16-pin narrow SOIC package, designed for isolated (ISOL) circuit applications. Built on a ceramic substrate with thin-film technology, it delivers exceptional stability with a ±25ppm/°C temperature coefficient and ±1% absolute tolerance. Each resistor offers 66.5Ω resistance at 0.1W (1/10W) power rating per element, totaling 0.8W for the network. The SOIC-C series construction ensures robust performance in a compact 9.91mm × 5.99mm × 1.45mm footprint, featuring gull-wing terminations for reliable surface-mount (SMD) assembly. Rated for 100V maximum voltage and 125°C operating temperature, it suits demanding environments with derated power handling up to 70–125°C.

GS8A0366R5FDT Features

• Precision & Stability: Thin-film resistors with ±1% tolerance and ±0.5% ratio tolerance ensure consistent signal integrity.
• High-Temperature Resilience: Operates up to 125°C with derated power capabilities.
• Compact & Robust: Ceramic case and SOIC package provide mechanical strength and thermal dissipation.
• Isolated Design: Independent resistors (non-bussed) for flexible circuit configurations.
• Low TCR: ±25ppm/°C minimizes resistance drift across temperature fluctuations.
• Automation-Friendly: 1.27mm terminal pitch and gull-wing leads enable high-speed PCB assembly.

GS8A0366R5FDT Applications

Ideal for precision analog and mixed-signal circuits, including:

• Voltage dividers & feedback networks in power supplies.
• Sensor signal conditioning (e.g., RTDs, strain gauges).
• Medical instrumentation requiring stable, low-drift performance.
• Industrial control systems with high-temperature demands.
• Communication equipment where impedance matching is critical.

Conclusion of GS8A0366R5FDT

The GS8A0366R5FDT stands out for its ceramic-based isolation, tight tolerances, and thermal resilience, making it superior to polymer-based networks in harsh environments. Its thin-film technology and SOIC packaging strike a balance between precision and manufacturability, catering to high-reliability applications in automotive (non-PPAP), industrial, and medical sectors. While non-RoHS compliant, its performance metrics justify use in specialized designs demanding long-term stability.