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GS8A038061JAT
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GS8A038061JAT Description
GS8A038061JAT Description
The GS8A038061JAT from TT Electronics/IRC is a high-performance 8-resistor thin-film network designed for precision applications requiring stable resistance values and low thermal drift. Encased in a 16-pin SOIC ceramic package, it features 8.06KΩ resistance per resistor with a tight ±5% tolerance and an ultra-low ±25ppm/°C temperature coefficient, ensuring reliable operation across a 70°C to 125°C derated power range. The isolated (ISOL) circuit design allows independent resistor functionality, while the 0.8W total power rating (0.1W per resistor) and 100V maximum voltage rating make it suitable for demanding environments. Its gull-wing termination and surface-mount (SMD) construction facilitate automated PCB assembly.
GS8A038061JAT Features
- Precision Thin Film Technology: Delivers stable performance with minimal drift.
- Ceramic SOIC Package: Enhances thermal stability and durability in harsh conditions.
- Isolated Resistor Network: Independent resistors enable flexible circuit design.
- Low TCR (±25ppm/°C): Maintains accuracy across temperature fluctuations.
- High Power Handling: 0.8W total (0.1W per resistor) for robust operation.
- Automation-Friendly: Gull-wing SMD terminals and 1.27mm pitch for easy PCB integration.
- Wide Operating Range: Rated for -55°C to +125°C, with derated power up to 125°C.
GS8A038061JAT Applications
Ideal for precision analog and digital circuits, this resistor network excels in:
- Signal Conditioning: Voltage dividers, feedback networks in op-amp circuits.
- Industrial Controls: PLCs, sensor interfaces requiring low drift.
- Medical Electronics: Patient monitoring systems demanding high reliability.
- Automotive (Non-Automotive Grade): Test equipment, prototyping where isolation is critical.
- Power Management: Current limiting, load balancing in DC/DC converters.
Conclusion of GS8A038061JAT
The GS8A038061JAT stands out for its ceramic-encased isolation, low TCR, and high power density, making it a superior choice over plastic-packaged networks in thermally challenging applications. While not PPAP or automotive-qualified, its precision thin-film construction and rugged SOIC form factor cater to industrial, medical, and test equipment markets. Engineers will appreciate its balance of performance, durability, and ease of integration, particularly in designs requiring stable, isolated resistances.



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